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JSSC 2023第6期Power ManagementSiGe HBT BiCMOS

Design Considerations for a Low-Power Fully Integrated MMIC Parametric Upconverter in SiGe BiCMOS

介绍了一种低功耗全集成毫米波参数上变频电路的设计方法。
60GHz, 1.5dB转换增益, 618µW功耗, 5GHz 3-dB IF带宽
毫米波参数上变频低功耗全集成SiGe HBT
利用二极管连接的HBT配置实现高Cmax/Cmin比
首次实现高频全集成上变频器
提出提高转换增益并降低功耗的设计方案
Abstract
This article presents the detailed design proce- dure of a millimeter-wave low-power fully integrated monolithic millimeter-wave integrated circuit (MMIC) parametric upcon- version circuit in SiGe heterojunction bipolar transistor (HBT) BiCMOS technology. This article comprehensively describes the design considerations to fully exploit the abrupt C–V char- acteristics achieved by the inve stigated diode-connected HBT configuration that, compared with traditionally employed devices, presents a C max /Cmin ratio two orders of magnitude higher. The parametric principle is revised in order to adapt its applicability for these devices and achieve, for the first time, a high-frequency and fully integrated upconverter implementation. Then, the presented concept is verified by designing a 60-GHz parametric double-sideband upconverter prototype. The fabricated circuit demonstrates a conversion gain up to 1.5 dB while consuming 618 µW. The circuit is optimized for wideband operation with a 3-dB IF bandwidth of 5 GHz in both sidebands. Further verification of the theory is provided, by demonstrating and measuring a solution to increase the conversion gain up to 5 dB while reducing the power consumption to 400 µW. In addition, it is shown how the presented distinct design procedure can be extrapolated, within the limitations of the particularly chosen nonlinear device, to design different parametric-based circuits at any arbitrary frequency band.