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JSSC 2023第8期Other65nm/22nm

A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/◦C Self-Biased CMOS-Only Current Reference in 65-nm Bulk and 22-nm FDSOI

提出一种基于自偏置CMOS的nA级温度无关电流基准,显著减小面积。
65nm: 0.7V, 1.1nA, 213ppm/°C; 22nm: 0.9V, 0.9nA, 565ppm/°C
电流基准温度无关自级联MOSFET纳米安培级面积效率
使用自级联MOSFET(SCM)结构
采用PTAT电压与CWT偏移偏置
在65nm和22nm工艺中实现超小面积设计
Abstract
In many applications, the ability of current ref- erences to cope with process, voltage, and temperature (PVT) variations is critical to maintaining system-level performance. However, temperature-independent current references operating in the nA range are rarely area-efficient due to the use of large resistors which occupy a significant silicon area at this current level. In this article, we introduce a nA-range constant- with-temperature (CWT) current reference relying on a self- cascode MOSFET (SCM), biased by a proportional-to-absolute- temperature (PTAT) voltage with a CWT offset. On the one hand, the proposed reference has been simulated post-layout in 65-nm bulk. This design consumes 5.4 nW at 0.7 V and achieves a 1.1-nA current with a line sensitivity (LS) of 0.69 %/V and a temperature coefficient (TC) of 213 ppm/ ◦C. On the other hand, the proposed reference has been simulated and fabricated in 22-nm fully depleted silicon-on-insulator (FDSOI). This second design requires additional features to mitigate the impact of parasitic diode leakage at high temperature. In measurement, it consumes 5.8 nW at 0.9 V and achieves a 0.9-nA current with a 0.39-%/V LS and a 565-ppm/ ◦C TC. As a result of using an SCM, the proposed references occupy a silicon area of 0.0021 mm 2 in 65 nm (respectively, 0.0132 mm 2 in 22 nm) at least 25× (respectively, 4×) smaller than state-of-the-art CWT references operating in the same current range.