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JSSC 2023第9期Clocking & PLLs0.13µmCrystal Oscillator

A Single-Trim Frequency Reference System With 0.7 ppm/°C From −63 ◦C to 165 ◦C Consuming 210 µW at 70 MHz Alexander S. Delke

提出一种单点温度修调和批量校准的高精度低功耗频率参考系统,替代晶体振荡器。
0.13µm HV CMOS SOI, 3V, 64µA, ±93ppm (-63°C~165°C), 0.69mm²
频率参考单点修调LC振荡器环形振荡器低功耗
创新点1:单点温度修调结合批量校准方法创新,通过工厂单点修调和数字存储技术,显著降低频率误差至±93 ppm,覆盖-63°C至165°C宽温范围,简化传统多温度点修调的复杂性。
创新点2:利用LC振荡器(LCO)校准环形振荡器(CCO)的系统创新,通过PVTL优化的LCO周期性校准CCO,实现高稳定性(52 ppm老化漂移)与低功耗(64 µA)的协同优化。
创新点3:高功率LC振荡器的深度占空比设计创新,通过间歇工作模式降低平均功耗,同时维持校准精度(92 ppm/V电源抑制),解决稳定性与功耗的矛盾。
创新点4:全集成化设计创新,在0.13-µm CMOS SOI工艺中整合电压调节器、温度传感器及校准引擎,芯片面积仅0.69 mm²,为晶体振荡器替代提供低成本解决方案。
Abstract
This article presents a frequency reference system that combines high frequency accuracy and low power consump- tion using a single-point temperature trim and batch calibration. The system is intended as a low-cost fully integrated crystal oscillator replacement. In this system, the oscillation frequency of a power-efficient, but process, voltage, temperature (PVT) and lifetime (L)-sensitive current-controlled ring oscillator (CCO) is periodically (re)calibrated by the well-behaved frequency stability of an untuned LC–based Colpitts oscillator (LCO), which is optimized for stability over PVT variations and lifetime (PVTL). During the single-point room temperature factory trim, the frequency of the LCO is determined and the result is digitally stored. An on-chip calibration engine tunes the CCO to the target frequency based on the LCO frequency, temperature sensor information, and digitally stored trimming information, thus effectively improving the frequency stability of the ring oscillator. The relatively high-power LCO is heavily duty-cycled to minimize the overall power consumption. A prototype fabricated in a 0.13-µm high-voltage (HV) CMOS SOI process and assembled in a plastic package demonstrates an inaccuracy lower than ±93 ppm over a temperature range from −63 ◦C to 165 ◦C across 18 samples. The presented frequency reference system, including on-chip voltage regulators and a temperature sensor, occupies a chip area of 0.69 mm 2 and consumes about 64 µA from a single 3