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JSSC 2023第11期RF & Wireless65nmPower Amplifier

H-Band Power Amplifiers in 65-nm CMOS by Adopting Output Power Maximized Gmax-Core and Transmission Line-Based Zero-Degree Power Combining Networks Byeonghun Yun , Dae-Woong Park , and Sang-Gug Lee

65nm CMOS工艺下采用输出功率最大化Gmax核心的H波段高效功率放大器设计
245GHz时Psat 9.2dBm, OP1dB 6dBm, PAE 4.6%, 增益28dB
功率放大器CMOSGmax核心功率组合器H波段
采用输出功率最大化的Gmax核心设计
使用传输线基零度功率组合器和分配器
全放大级采用Gmax概念最大化每级增益
Abstract
This article proposes high-gain, high-output-power, and high-power-added efficiency (PAE) power amplifiers (PAs) by adopting an output power maximized (OPM) maximum achievable gain (Gmax)-core with the transmission line (TL)-based zero-degree power combiners (ZDCs) and zero-degree splitters (ZDSs). By utilizing the proposed small- and large-signal two- port network parameter-based analysis for implementing the Gmax-core, the last-stage OPM Gmax-core can maximize large- signal output power and small-signal gain at the same time. In addition, by adopting the Gmax-concept in all amplifying stages, the amount of gain per stage can be maximized, leading to higher PAE. For implementing the low-loss power combin- ing (PC) and splitting networks, ZDC and ZDS are adopted. By adopting the proposed OPM Gmax-core and ZDCs and ZDSs, six-stage 250-GHz two- and four-way PC PAs are implemented in a 65-nm CMOS process. The two PAs achieve Psat of 9.2 and 10.5 dBm, OP 1 dB of 6 and 7.7 dBm, PAE of 4.6% and 2.8%, and power gains of 28 and 26 dB at 245 and 243 GHz, respectively.