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A Low-Power 256-Element K a-Band CMOS Phased-Array Receiver With On-Chip Distributed Radiation Sensors for Small
一款低功耗256单元Ka波段CMOS相控阵接收器,适用于LEO小卫星通信系统。
2.95 mW/单元, -20dBm IIP3, 3.6dB噪声系数, 0.24mm²/单元
低功耗Ka波段CMOS相控阵LEO卫星通信分布式传感器
▸创新点1:分布式电流共享共栅极低噪声放大器(电路创新)。通过分布式电流共享技术,显著降低了功耗,同时保持了低噪声性能,实现了2.95 mW/元素的低功耗设计。
▸创新点2:电压调谐可变增益放大器(电路创新)。采用上下晶体管共同贡献增益的设计,优化了功耗效率,支持宽范围的增益调节,提升了系统的灵活性。
▸创新点3:片上分布式辐射传感器(系统创新)。通过分布式传感器消除了不均匀辐射的影响,实现了0.22-dB/Mrad的增益退化性能,提高了系统的稳定性和可靠性。
▸创新点4:256元素Ka波段相控阵接收机(系统创新)。支持DVB-S2X标准调制信号,实现了-31.3-dB EVM和24-Gb/s的链路速度,覆盖-50°至+50°的辐射角度,旁瓣电平低于-9-dBc。
Abstract
This article presents a low-power 256-element K a-band CMOS phased-array receiver utilizing ON-chip dis- tributed radiation sensors for the low Earth orbit (LEO) small satellite communication system. Since the available solar cell area limits the power generation of the small LEO satellites, a distributed current-sharing common-gate (CG) low noise amplifier (LNA) and a voltage-tuning variable gain amplifier (VGA) are introduced to reduce power consumption. After utilizing the proposed technique, the power consumption of the beamformer is 2.95 mW/element. Moreover, the proposed voltage-tuning VGA is configured to utilize both upper and lower transistors for gain contributions to save power. The ON- chip distributed radiation sensors are presented to eliminate the non-uniform radiation influence and realize 0.22-dB/Mrad gain degradation performance. The proposed receiver achieves −20- dBm single-element IIP3 with a 3.6-dB noise figure. The occupied ON-chip area for a single element is only 0.24 mm 2. DVB-S2X standard modulated signals of up to 256 amplitude and phase- shift keying (APSK) can be supported in the over-the-air (OTA) measurement. The receiver achieves −31.3-dB EVM and 24- Gb/s link speed under 1.5-GBaud dual-linear polarization signals. The measured 256-element beam pattern can cover radiated angle from −50◦ to +50◦ with lower than −9-dBc sidelobe level. Manuscript received 15 May 2023; revised 30 July 2023; accepted 25 August 2023. Date of publication 2 October 20