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A 4-bit Calibration-Free Computing-In-Memory Macro With 3T1C Current-Programed Dynamic-Cascode Multi-Level-Cell eDRAM
提出一种无需校准的4位电流编程存内计算宏,采用3T1C eDRAM单元,提升能效和精度。
65nm CMOS, 233-304 TOPS/W, 0.4ms刷新间隔, CIFAR10 >90%推理准确率
存内计算电流编程3T1C单元能效优化神经网络加速
▸3T1C eDRAM单元实现电流编程存内计算
▸电压-电流两步编程方案提升写入速度
▸伪差分CIM单元支持4位有符号权重
Abstract
Analog computing-in-memory (CIM) has been widely explored for computing neural networks (NNs) efficiently. However, most analog CIM implementations trade compute accuracy for energy efficiency. The low accuracy restricts the practical application of analog CIM. In this article, a current- programming CIM that unifies the weight programming and computing in the current domain is proposed to address this dilemma. The enabled technique is a novel 3-transistor 1- capacitor (3T1C) embedded dynamic random access memory (eDRAM) cell. The current-programming mechanism and the dynamic-cascode read structure of the 3T1C cell make it immune to transistor-level non-idealities, including nonlinear I–V, thresh- old voltage variations, and short-channel effect. Therefore, the cell enables multi-level-cell (MLC) operations without any cal- ibration, supporting eight current-weight levels (0–700 nA). In addition, a voltage–current two-step programming scheme is proposed to boost the sub-microamphere current-weight writing speed. To support signed 4-b weights, a pseudo-differential CIM cell composed of two 3T1C MLCs is developed. Fabricated in a 65-nm CMOS, the prototype demonstrates 2.2× reduction in macro-level variation through current programming. Bene- fiting from sub-microamphere compute currents, the prototype achieves the 4-b energy efficiencies of 233–304 TOPS/W. With a refresh interval of 0.4 ms, the macro achieves >90% inference accuracy on CIFAR10.