A Chip-PCB Hybrid SC PUF Used for Anti-Desoldering and Depackaging-Attack Protec

Abstract

By sensing and changing the parasitic capacitance mismatch of chip pads, bumps or bonding wires, package substrate and balls, and printed circuit board (PCB) solder joints and traces into on-chip keys, the proposed chip-PCB hybrid switched-capacitor (SC) physical unclonable function (PUF) can detect the capacitance alteration caused by damaging of the package or removing of the chip from the original PCB, thereby achieving the anti-desoldering and depackaging-attack protection for the security c