← 返回 JSSC 论文列表JSSC 2024第8期RF & Wireless180nmPhased Array
A 125 µm-Pitch-Matched Transceiver ASIC With Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography
本文介绍了一种用于经囟门超声检查的可穿戴设备中的125µm间距匹配收发器ASIC。
180nm BCD, 1.83 mW/element, 3.84 Gb/s, 3.3 pJ/bit
收发器ASIC微波束成形多级数据链路可穿戴设备超声检查
▸创新点1:基于被动箱车积分的微波束成形ADC(方法创新)。该技术通过将被动箱车积分与10位40 MS/s SAR ADC在电荷域合并,消除了显式抗混叠滤波(AAF)和高功耗ADC驱动器的需求,显著降低了系统复杂度和功耗。
▸创新点2:低功耗多级数据链路(系统创新)。采用基于16级脉冲幅度调制的多级数据链路,将四个ADC的输出串联,实现了128倍的通道数减少,同时以3.84 Gb/s的聚合数据速率和3.3 pJ/bit的能效运行。
▸创新点3:紧凑低功耗参考发生器(电路创新)。利用面积高效的MOS电容器作为电荷域ADC的快速参考设置,减少了传统参考发生器的面积和功耗,提升了整体系统的能效。
▸创新点4:高集成度收发器ASIC(系统创新)。该ASIC集成了20-V单极性脉冲发生器、接收电路和微束成形技术,实现了125 µm间距匹配的16×16元素PZT换能器阵列接口,每元素功耗仅为1.83 mW,适用于可穿戴超声设备。
Abstract
This article presents a pitch-matched transceiver application-specific integrated circuit (ASIC) for a wearable ultrasound device intended for transfontanelle ultrasonography, which includes element-level 20-V unipolar pulsers with transmit (TX) beamforming, and receive (RX) circuitry that combines eightfold multiplexing, four-channel micro-beamforming (µBF), and subgroup-level digitization to achieve an initial 32-fold channel-count reduction. The µBF is based on passive boxcar integration, merged with a 10-bit 40 MS/s SAR ADC in the charge domain, thus obviating the need for explicit anti-alias filtering (AAF) and power-hungry ADC drivers. A compact and low-power reference generator employs an area-efficient MOS capacitor as a reservoir to quickly set a reference for the ADC in the charge domain. A low-power multi-level data link, based on 16-level pulse-amplitude modulation, concatenates the outputs of four ADCs, providing an overall 128-fold channel-count reduc- tion. A prototype transceiver ASIC was fabricated in a 180-nm BCD technology, and interfaces with a 2-D PZT transducer array of 16 × 16 elements with a pitch of 125 µm and a center frequency of 9 MHz. The ASIC consumes 1.83 mW/element. The data link achieves an aggregate 3.84 Gb/s data rate with 3.3 pJ/bit energy efficiency. The ASIC’s functionality has been demonstrated through electrical, acoustic, and imaging experiments.