JSSC 2024第10期RF & Wireless65nm CMOS/0.1µm GaAsPower AmplifierLNA

KKa-Band Hybrid-Packaged Four-Element Four-Beam Phased-Array Transmitter and Rec

本文提出了一种K/Ka波段四元素四波束相控阵收发前端，采用混合封装技术，结合65nm CMOS波束成形器和0.1µm GaAs功率放大器/低噪声放大器。

23.5–26.5 dB增益, 21.2–23.2 dBm P1dB, 26%–30% PAE

K/Ka波段相控阵混合封装波束成形功率放大器

▸创新点1：混合封装技术（Hybrid-packaged technology）结合65-nm CMOS和0.1-µm GaAs工艺，实现了高集成度的K/Ka波段相控阵前端，通过优化封装结构降低了信号路由复杂度，同时保持了阵列增益不退化。

▸创新点2：优化的树型和矩形波束成形网络（Tree-type and rectangular-shaped beamforming networks）通过对称布局设计提高了波束间一致性和隔离度，显著提升了系统性能的均匀性和稳定性。

▸创新点3：L型电感增强匹配网络（L-type inductor-enhanced matching network）在接收端（RX）中采用新型匹配结构，有效拓宽了带宽，同时实现了3.1 dB的最低噪声系数（NF），提升了接收灵敏度。

▸创新点4：数字电路引入投票机制（Voting mechanism in digital circuit）增强了系统的容错能力，结合低功耗相位/幅度控制技术，提供了高能效的波束成形解决方案，最大功耗控制在2600 mW（TX）和264 mW（RX）以内。

Abstract

This article presents K/Ka-band four-element four- beam phased-array transmitter (TX) and receiver (RX) front- ends. Hybrid-packaged technology is employed, consisting of one TX/RX 65-nm CMOS beamformer and four 0.1-µm GaAs power amplifiers (PAs)/low-noise amplifiers (LNAs). Each beam maintains a full connection to every antenna element with- out degrading array gain. A compact and symmetrical layout floor-plan is proposed to reduce signal routing complexity. Signal distribution and combination