ISSCC 2012
Session 23
Other
A 2.5D Integrated Voltage Regulator Using CoupledMagnetic-Core Inductors on Silicon Interposer Delivering 10.8A/mm2
Bucknell Webb2, Lubomyr Romankiw2, Michele Petracca1, Ryan Davies1, Robert Fontana3, Gary Decad3, Ioannis Kymissis1, Angel Peterchev4, Luca Carloni1, William Gallagher2, Kenneth Shepard1 1 3 Columbia University, New York
ISSCC 2012
Session 23
Other
A Modular 1mm3 Die-Stacked Sensing Platform with Optical Communication and Multi-Modal Energy Harvesting
applications such as smart buildings, medical implants, and surveillance systems. However, existing devices are bulky, measuring >1cm3, and they are hampered by short lifetimes and fail to realize the “smart dust” vision
ISSCC 2012
Session 23
Other
A DC-Isolated Gate Drive IC With Drive-byMicrowave Technology for Power Switching Devices
Field-Effect Transistors)
ISSCC 2012
Session 23
Other
Nonvolatile 3D-FPGA With Monolithically Stacked RRAM-Based Configuration Memory
area, delay, and power consumption of FPGAs relative to ASICs. In [1] it is estimated that a 3D-FPGA with the configuration memory stacked on top of the FPGA logic and routing can achieve 57% smaller die area than a base
ISSCC 2012
Session 24
Wireline I/O
A Sub-2W 10GBASE-T Analog Front-End in 40nm CMOS process
Ramesh Singh1, Hesam Aslanzadeh1, Alireza Khalili1, Saurabh Vats1, Susan Arno1, Sean Campeau2 Applied Micro, Sunnyvale, CA Applied Micro, Kanata, ON, Canada 1 2 The IEEE802.3an 10GBase-T standard [1] provides full duplex
ISSCC 2012
Session 24
Wireline I/O
A 16-Port FCC-Compliant 10GBASE-T Transmitter and Hybrid with 76dBc SFDR up to 400MHz Scalable to 48 Ports
David Nguyen, Hiok-Tiaq Ng, Ramin Shirani Aquantia, Milpitas, CA High-density 48-port network switches demand very power-efficient, small form-factor quad PHYs which comply with the IEEE 802.3an transmit PSD and return-l
ISSCC 2012
Session 24
Wireline I/O
A 10Gb/s Burst-Mode Laser Diode Driver for Burstby-Burst Power Saving
A burst-mode laser diode driver circuit (BLDD) for 10Gb/s-class passive optical network (10G-EPON) systems reduces power consumption by 94% while the laser diode (LD) is in the off state. The off-state optical launch pow
ISSCC 2012
Session 24
Wireline I/O
A 10Gb/s Burst-Mode TIA with On-Chip Reset/Lock CM Signaling Detection and Limiting Amplifier with a 75ns Settling Time
France 1 2 Emerging symmetric 10Gb/s passive optical network (PON) systems aim at high network transmission efficiency by reducing the RX settling time that is needed for RX amplitude recovery in burst-mode (BM). A conve
ISSCC 2012
Session 24
Wireline I/O
25Gb/s 3.6pJ/b and 15Gb/s 1.37pJ/b VCSEL-Based Optical Links in 90nm CMOS
Future high-performance computing systems require sub-2pJ/bit power efficiencies at >10Gb/s [1-2]. The best reported optical link efficiencies at these data rates are ≥2.5pJ/bit [1-4]. This paper describes two VCSEL-base
ISSCC 2012
Session 25
Memory
A 19nm 112.8mm2 64Gb Multi-Level Flash Memory with 400Mb/s/pin 1.8V Toggle Mode Interface
T. Shimizu1, T. Sugimoto1, T. Kobayashi1, K. Inuzuka1, N. Kanagawa1, Y. Kajitani1, T. Ogawa1, J. Nakai1, K. Iwasa1, M. Kojima1, T. Suzuki1, Y. Suzuki1, S. Sakai1, T. Fujimura1, Y. Utsunomiya1, T. Hashimoto1, M. Miakashi1
ISSCC 2012
Session 25
Memory
Over-10×-Extended-Lifetime 76%-Reduced-Error Solid-State Drives (SSDs) with Error-Prediction LDPC Architecture and Error-Recovery Scheme
This paper presents solid-state drives (SSDs) with two high reliability techniques. First, an error-prediction (EP) low-density-parity-check (LDPC) errorcorrecting code (ECC) that realizes an over 10× extended lifetime.
ISSCC 2012
Session 25
Memory
Gb/s Multi-Threaded BCH Encoder and Decoder for Multi-Channel SSD Controllers
Solid-state drives (SSDs), built with many flash memory channels, is usually connected to the host through an advanced high-speed serial interface such as SATA III associated with a transfer rate of 6Gb/s [1-2]. However,
ISSCC 2012
Session 25
Memory
Bitline-Capacitance-Cancelation Sensing Scheme with 11ns Read Latency and Maximum Read Throughput of 2.9GB/s in 65nm Embedded Flash for Automotive
Christian Peters1, Christoph Parzinger1, Christoph Roll1, Stephan Kassenetter1, Stefanie Thierold1, Doris Schmitt-Landsiedel2 Infineon, Neubiberg, Germany, 2Technical University Munich, Munich, Germany 1 The markets tren
ISSCC 2012
Session 25
Memory
A 64Gb 533Mb/s DDR Interface MLC NAND Flash in Sub-20nm Technology
Dong-Su Jang, Wook-Ghee Hahn, Jong-Yeol Park, Doo-Gon Kim, Chiweon Yoon, Bong-Soon Lim, Byung-Jun Min, Sung-Won Yun, Ji-Sang Lee, Il-Han Park, Kyung-Ryun Kim, Jeong-Yun Yun, Youse Kim, Yong-Sung Cho, Kyung-Min Kang, Sang
ISSCC 2012
Session 25
Memory
An 8Mb Multi-Layered Cross-Point ReRAM Macro with 443MB/s Write Throughput
Yoshikazu Katoh1, Kouhei Tanabe2, Toshihiro Nakamura2, Yoshihiko Sumimoto2, Naoki Yamada2, Nobuyuki Nakai2, Shoji Sakamoto2, Yukio Hayakawa1, Kiyotaka Tsuji1, Shinichi Yoneda1, Atsushi Himeno1, Ken-ichi Origasa2, Kazuhik
ISSCC 2012
Session 25
Memory
A 0.5V 4Mb Logic-Process Compatible Embedded Resistive RAM (ReRAM) in 65nm CMOS Using LowVoltage Current-Mode Sensing Scheme with 45ns Random Read Time
mobile chips, such as energy-harvestingpowered devices and biomedical applications, require low-VDD on-chip nonvolatile memory (NVM) for low-power active-mode access and power-off data storage. However, conventional NVMs
ISSCC 2012
Session 25
Memory
128Gb 3b/Cell NAND Flash Memory in 19nm Technology with 18MB/s Write Rate and 400Mb/s Toggle Mode
Nima Mokhlesi1, Cynthia Hsu1, Jason Li1, Venky Ramachandra1, Teruhiko Kamei1, Masaaki Higashitani1, Tuan Pham1, Mitsuaki Honma2, Yoshihisa Watanabe2, Kazumi Ino2, Binh Le1, Byungki Woo1, Khin Htoo1, Tai-Yuan Tseng1, Long
ISSCC 2012
Session 26
Wireless
A 1V 357Mb/s-Throughput TransferJetTM SoC with Embedded Transceiver and Digital Baseband in 90nm CMOS
Yasunori Aoki1, Yusuke Shinohe1, Koki Uchino1, Yuhei Hashimoto1, Fumihiro Nishiyama1, Hiroaki Miyachi1, Ikuho Nagase2, Itaru Uezono2, Rie Hisamura2, Itaru Maekawa1 Sony, Tokyo, Japan Sony Semiconductor, Kagoshima, Japan
ISSCC 2012
Session 26
Wireless
A 2Gb/s 150mW UWB Direct-Conversion Coherent Transceiver with IQ-Switching Carrier Recovery Scheme
Short-distance (<10cm) wireless communications applications are rapidly expanding. For instance, a fast file transfer by “touch-and-proceed data communication” provides a user-friendly interface for electronic products [
ISSCC 2012
Session 26
Wireless
3-to-5GHz 4-Channel UWB Beamforming Transmitter with 1° Phase Resolution Through Calibrated Vernier Delay Line in 0.13µm CMOS
Narrow-band phased-array transmitters provide an efficient way of obtaining higher power through spatial combining and achieving higher transmitter EIRP. They also provide beamforming and beam-steering capabilities [1].
ISSCC 2012
Session 26
Wireless
An Interference-Aware 5.8GHz Wake-Up Radio for ETCS
PHYCHIPS, Daejeon, Korea 1 2 Wake-up radios have been a popular transceiver architecture in recent years for battery-powered applications such as wireless body area networks (WBANs) [1], wireless sensor networks (WSNs) [
ISSCC 2012
Session 26
Wireless
A 2.7nJ/b Multi-Standard 2.3/2.4GHz Polar Transmitter for Wireless Sensor Networks
3/2.4GHz multi-standard transmitter (TX) for wireless sensor networks and wireless body area networks. Several 2.3/2.4GHz wireless standards have been proposed for such applications, including IEEE802.15.6 (BAN) for body
ISSCC 2012
Session 26
Wireless
A Meter-Range UWB Transceiver Chipset for Aroundthe-Head Audio Streaming
Xiongchuan Huang1, Cui Zhou1, Mario Konijnenburg1, Kathleen Philips1, Harmke De Groot1 imec - Holst Centre, Eindhoven, The Netherlands NXP Semiconductors, Eindhoven, The Netherlands 1 2 Any around-the-body wireless syste
ISSCC 2012
Session 26
Wireless
A 90nm CMOS 5Mb/s Crystal-Less RF Transceiver for RF-Powered WSN Nodes
free-of-maintenance solution for wireless sensor network (WSN) applications. By combining sensing functionalities and batteryless (RFID-like) wireless connectivity, these devices provide a viable option for all those sce
ISSCC 2012
Session 26
Wireless
A 915MHz 120µW-RX/900µW-TX Envelope-Detection Transceiver with 20dB In-Band Interference Tolerance
Netherlands 1 2 Minimizing the power consumption while maintaining performance is paramount in radio transceiver design for low-power wireless sensor network (WSN) applications. Given a sub-mW power budget, many radios h
ISSCC 2012
Session 27
Data Converters
A 14b 3/6GHz Current-Steering RF DAC in 0.18µm CMOS with 66dB ACLR at 2.9GHz
The growth in communications coupled with the move towards multi-carrier, multi-band, multi-standard radio transmitters have helped drive high-speed digital-to-analog converter (DAC) technology for over a decade. The cri
ISSCC 2012
Session 27
Data Converters
Ring Amplifiers for Switched-Capacitor Circuits
design of switched-capacitor amplification circuits, designers must consider a growing number of design tradeoffs and employ new circuit techniques in order to achieve required accuracies, often at a cost of added power
ISSCC 2012
Session 27
Data Converters
A 5.37mW 10b 200MS/s Dual-Path Pipelined ADC
The opamps in a switched-capacitor (SC) pipelined ADC provide the functions of sample-and-hold, residue generation, and residue amplification [1,2]. High-performance opamps that meet the requirements for dc gain, speed,
ISSCC 2012
Session 27
Data Converters
A 13b 315fsrms 2mW 500MS/s 1MHz Bandwidth Highly Digital Time-to-Digital Converter Using Switched Ring Oscillators
Time-to-digital converters (TDCs) were historically used in laser range-finding, automatic test equipment, and timing jitter measurements, but recent developments in the design of high-resolution TDCs have paved the way
ISSCC 2012
Session 27
Data Converters
A 1.7mW 11b 250MS/s 2× Interleaved Fully Dynamic Pipelined SAR ADC in 40nm Digital CMOS
Renesas Electronics, Kawasaki, Japan 1 2 In recent years ADC research has resulted in impressive advances in power efficiency. SAR ADCs have reached energies per conversion step below 10fJ, but only at rather low samplin
ISSCC 2012
Session 27
Data Converters
A 90MS/s 11MHz Bandwidth 62dB SNDR Noise-Shaping SAR ADC
In recent years, charge-redistribution SAR (Successive Approximation) ADCs have exhibited the highest conversion efficiencies for ADCs with moderate resolution and bandwidth [1-3]. For effective resolutions beyond 10b or
ISSCC 2012
Session 27
Data Converters
A 70dB DR 10b 0-to-80MS/s Current-Integrating SAR ADC with Adaptive Dynamic Range
to develop more innovative systems to improve performance. Remarkable improvements have been recently realized on charge-domain SAR ADCs to reach the speed of a few tens of MS/s with medium resolution and low power consu
ISSCC 2012
Session 27
Data Converters
A 7-to-10b 0-to-4MS/s Flexible SAR ADC with 6.5-to-16fJ/conversion-step
However, each application has different requirements for accuracy and bandwidth. Recent power-efficient ADCs for sensor applications are mostly designed for a fixed accuracy and a limited range of sample rates [1,2]. An
ISSCC 2012
Session 27
Data Converters
A 31.3fJ/conversion-step 70.4dB SNDR 30MS/s 1.2V Two-Step Pipelined ADC in 0.13µm CMOS
National Semiconductor, Santa Clara, CA which may be done simply by changing the gain combination in the two cascaded gain stages. Such optimization may lead to further reduction in power consumption and also allow for l
ISSCC 2012
Session 28
Power Management
A 4.5Tb/s 3.4Tb/s/W 64×64 Switch Fabric with Self-Updating Least-Recently-Granted Priority and Quality-of-Service Arbitration in 45nm CMOS
building blocks of on-die interconnect fabrics that are critical to overall throughput and energy efficiency of high performance systems [1,2]. Conventional routers use distinct logic blocks for routing data and handling
ISSCC 2012
Session 28
Power Management
A 1.0TOPS/W 36-Core Neocortical Computing Processor with 2.3Tb/s Kautz NoC for Universal Visual Recognition
Unlike human brains, where various kinds of visual recognition tasks are carried out with homogeneous neocortical circuits and a unified working mechanism, existing visual recognition processors [1-4] rely on multiple al
ISSCC 2012
Session 28
Power Management
Conditional Push-Pull Pulsed Latches with 726fJ·ps Energy-Delay Product in 65nm CMOS
University of Siena, Siena, Italy 3 University of Michigan, Ann Arbor, MI 4 University of California at Berkeley, Berkeley, CA 1 2 Flip-flops (FFs) are key building blocks in the design of high-speed energy-efficient mic
ISSCC 2012
Session 28
Power Management
A 200mV 32b Subthreshold Processor with Adaptive Supply Voltage Control
digital systems with limited energy budget (e.g. mobile, battery-powered devices, radio frequency identification (RFID), wireless sensor networks, or biomedical applications). Subthreshold operation allows for such low p
ISSCC 2012
Session 28
Power Management
13% Power Reduction in 16b Integer Unit in 40nm CMOS by Adaptive Power Supply Voltage Control with Parity-Based Error Prediction and Detection (PEPD) and Fully Integrated Digital LDO
Scaling power supply voltages (VDD’s) of logic circuits down to the sub/nearthreshold region is a promising approach to achieve significant power reductions. Circuit delays in the ultra-low voltage region, however, are e
ISSCC 2012
Session 28
Power Management
Bubble Razor: An Architecture-Independent Approach to Timing-Error Detection and Correction
and correcting transient delay errors have been proposed [1-5]. These Razor-style systems replace critical flip-flops with ones that detect late arriving signals, and use architectural replay to correct errors. However,
ISSCC 2012
Session 28
Power Management
A 25MHz 7µW/MHz Ultra-Low-Voltage Microcontroller SoC in 65nm LP/GP CMOS for Low-Carbon Wireless Sensor Nodes
François Durvaux1, Sarah Boyd2, Denis Flandre1, Jean-Didier Legat1 1 2 Université catholique de Louvain, Louvain-la-Neuve, Belgium P.E. International, Berkeley, CA The vision of the Internet of Things with ambient intell
ISSCC 2012
Session 28
Power Management
A 530mV 10-Lane SIMD Processor with Variation Resiliency in 45nm SOI
exhibits improved energy efficiency compared to nominal super-threshold operation [1, 2]. Two critical bottlenecks prevent mainstream adoption of low-VDD operation: degraded logic delay resulting in significantly lower t
ISSCC 2012
Session 3
Digital Processors
A 22nm IA Multi-CPU and GPU System-on-Chip
processor codenamed Ivy Bridge that integrates up to four high-performance Intel Architecture (IA) cores, a power/performance optimized graphics/media processing unit (GPU), as well as memory, PCIe, and display controlle
ISSCC 2012
Session 3
Digital Processors
A 32-Core RISC Microprocessor with Network
Brian Miller, Derek Brasili, Tim Kiszely, Rob Kuhn, Rahul Mehrotra, Manan Salvi, Mandar Kulkarni, Anand Varadharajan, Shi-Huang Yin, William Lin, Adam Hughes, Bill Stysiack, Vasu Kandadi, Ilan Pragaspathi, Dan Hartman, D
ISSCC 2012
Session 3
Digital Processors
The Next-Generation 64b SPARC Core in a T4 SoC Processor
Youngmoon Choi, Harikaran Sathianathan, Sudesna Dash, Sebastian Turullols, Song Kim, Robert Masleid, Georgios Konstadinidis, Robert Golla, Mary Jo Doherty, Greg Grohoski, Curtis McAllister Oracle, Santa Clara, CA The T4
ISSCC 2012
Session 3
Digital Processors
32nm x86 OS-Compliant PC On-Chip with Dual-Core Atom® Processor and RF WiFi Transceiver
Rahul Limaye3, Jon Duster1, Yulin Tan1, Ajay Balankutty1, Erkan Alpman1, Chun Lee1, Satoshi Suzuki1, Brent Carlton1, Hyung Seok Kim1, Marian Verhelst1, Stefano Pellerano1, Tong Kim2, Durgesh Srivastava1, Satish Venkatesa
ISSCC 2012
Session 3
Digital Processors
An 800MHz 320mW 16-Core Processor with Message-Passing and Shared-Memory Inter-Core Communication Mechanisms
simple programming model. Recently, however, the message-passing mechanism is also drawing attention due to its potentially better scalability [1-2]. In this work, we demonstrate that a hybrid communication mechanism sup
ISSCC 2012
Session 3
Digital Processors
A 280mV-to-1.2V Wide-Operating-Range IA-32 Processor in 32nm CMOS
Praveen Salihundam1, Shiva Ramani1, Sriram Muthukumar1, Srinivasan M1, Arun Kumar1, Shasi Kumar Gb1, Rajaraman Ramanarayanan1, Vasantha Erraguntla1, Jason Howard2, Sriram Vangal2, Saurabh Dighe2, Greg Ruhl2, Paolo Aseron
ISSCC 2012
Session 3
Digital Processors
Resonant Clock Design for a Power-Efficient High-Volume x86-64 Microprocessor
Ann Arbor, MI 1 2 AMD’s 4+ GHz x86-64 core codenamed “Piledriver” employs resonant clocking [1-4] to reduce clock distribution power up to 24% while maintaining a low clock-skew target. To support testability and robust
ISSCC 2012
Session 3
Digital Processors
A Reconfigurable Distributed All-Digital Clock Generator Core With SSC and Skew Correction in 22nm High-k Tri-Gate LP CMOS
including CPU, graphics, I/O interface, wireless transceivers and the power management unit, operate at different frequencies as shown in Fig. 3.8.1. In addition, maximizing battery life requires localized dynamic voltag