ISSCC 2015
Session 22
Wireline I/O
A 25Gb/s 4.4V-Swing AC-Coupled Si-Photonic Microring Transmitter with 2-Tap Asymmetric FFE and Dynamic Thermal Tuning in 65nm CMOS
Ayman Shafik3, Nan Qi1, Yang Liu5, Ran Ding5, Tom Baehr-Jones5, Marco Fiorentino4, Michael Hochberg5, Samuel Palermo3, Patrick Yin Chiang1,6 Oregon State University, Corvallis, OR, 2University of Delaware, Newark, DE, Te
ISSCC 2015
Session 22
Wireline I/O
4×25.78Gb/s Retimer ICs for Optical Links in 0.13μm SiGe BiCMOS
power, high-density, multilane links with a data rate exceeding 25Gb/s/lane are needed. An optical transceiver with a retiming capability would significantly enhance the usability of the link by extending the reach. Such
ISSCC 2015
Session 22
Wireline I/O
A 24-to-35Gb/s ×4 VCSEL Driver IC with Multi-Rate Referenceless CDR in 0.13μm SiGe BiCMOS
and high-density interconnects because of the high-bandwidth and low-crosstalk properties of optical signals. The next challenge for optical interconnects is to move to a serial data-rate of 25Gb/s or higher [1,2]. To ac
ISSCC 2015
Session 22
Wireline I/O
A 1310nm 3D-Integrated Silicon Photonics Mach-Zehnder-Based Transmitter with 275mW Multistage CMOS Driver Achieving 6dB Extinction Ratio at 25Gb/s
University of Pavia, Pavia, Italy, STMicroelectronics, Pavia, Italy 1 2 Data centers and high-performance computing markets are growing at a fast pace, mandating power-efficient and cost-effective high-speed interconnect
ISSCC 2015
Session 23
Digital Processors
20nm High-κ Metal-Gate Heterogeneous 64b Quad-Core CPUs and Hexa-Core GPU for High-Performance and Energy-Efficient Mobile Application Processor
Kwangil Kim, Ken Shin, Yohan Kwon, Heungchul Oh, Jaeyoung Lim, Dong-wook Lee, Jongho Lee, Inpyo Hong, Kyungkuk Chae, Heon-Hee Lee, Sung-Wook Lee, Seongho Song, Chung-Hee Kim, Jin-Soo Park, Heesoo Kim, Sunghee Yun, Uk-Rae
ISSCC 2015
Session 23
Digital Processors
A 1920×1080 30fps 611mW Five-View Depth-Estimation Processor for Light-Field Applications
essential in emerging computer vision applications. Although active sensing methods can provide an accurate indoor depth map, they have limited resolution and consume significant power, such as the 2.1W time-of-flight se
ISSCC 2015
Session 23
Digital Processors
A Highly Integrated Smartphone SoC Featuring a 2.5GHz Octa-Core CPU with Advanced High-Performance and Low-Power Techniques
Ichiro Lin1, HsinChen Chen1, Wuan Kuo2, Anand Rajagopalan1, Wei-Zheng Ge1, Rolf Lagerquist1, Syed Rahman1, CJ Chung1, Simon Wang2, Lee-Kee Wong2, Yi-Chang Zhuang2, Kent Li1, Jidong Wang1, Minh Chau1, Yijing Liu1, Daniel
ISSCC 2015
Session 24
Other
Circuit Challenges from Cryptography
similar to applications in other fields. We have to worry about comparable optimization goals: area, power, energy, throughput and/or latency. Moore’s law helps to attain these goals. However, it also gives the attackers
ISSCC 2015
Session 24
Other
Context-Aware Hierarchical Information-Sensing in a 6µW 90nm CMOS Voice Activity Detector
The rise of always-listening sensors integrated in energy-scarce devices such as watches and remote-controls increases the need for intelligent scalable interfaces. Contemporary sensor interfaces digitize raw sensor data
ISSCC 2015
Session 24
Other
20k-spin Ising Chip for Combinational Optimization Problem with CMOS Annealing
will slow down due to the end of semiconductor scaling. Presently a new computing paradigm, so-called natural computing, which maps problems to physical models and solves the problem by its own convergence property, is e
ISSCC 2015
Session 24
Other
A 6.5Gb/s Shared Bus Using Electromagnetic Connectors for Downsizing and Lightening Satellite Processor System by 60%
mounted in satellites must be small and light, having high data transfer rates, and high storage capacity [1]. A small reduction in size and weight could reduce the cost of launching a satellite by a significant amount.
ISSCC 2015
Session 25
RF & Wireless
A Highly-Digital Frequency Synthesizer Using RingOscillator Frequency-to-Digital Conversion and Noise Cancellation
Digital fractional-N PLLs are increasingly used in place of analog fractional-N PLLs as frequency synthesizers in wireless applications, because they avoid large analog loop filters and can tolerate device leakage and lo
ISSCC 2015
Session 25
RF & Wireless
A 2.2GHz -242dB-FOM 4.2mW ADC-PLL Using Digital Sub-Sampling Architecture
loop (PLL) using a voltage-domain digitization realized by an analog-to-digital converter (ADC). It consists of an 18b Class-C digitally-controlled oscillator (DCO), 4b comparator, digital loop filter (DLF), and frequenc
ISSCC 2015
Session 25
RF & Wireless
A VCO with Implicit Common-Mode Resonance
CMOS VCO performance metrics have not improved significantly over the last decade. Indeed, the best VCO Figure of Merit (FOM) currently reported was published by Hegazi back in 2001 [1]. That topology, shown in Fig. 25.3
ISSCC 2015
Session 25
RF & Wireless
A 1/f Noise Upconversion Reduction Technique Applied to Class-D and Class-F Oscillators
The 1/f (flicker) noise upconversion degrades the close-in spectrum of CMOS RF oscillators. The resulting 1/f3 phase noise (PN) can be an issue in PLLs with a loop bandwidth of <1MHz, which practically implies all cellul
ISSCC 2015
Session 25
RF & Wireless
A 320GHz Phase-Locked Transmitter with 3.3mW Radiated Power and 22.5dBm EIRP for Heterodyne THz Imaging Systems
STMicroelectronics, Crolles, France 1 2 Non-ionizing terahertz imaging using solid-state integrated electronics has been gaining increasing attention over the past few years. However, there are currently several factors
ISSCC 2015
Session 25
RF & Wireless
A 70.5-to-85.5GHz 65nm Phase-Locked Loop with Passive Scaling of Loop Filter
(PLLs) are required to have wide a frequency tuning range from 71 to 86GHz and low phase noise of -90dBc/Hz @1MHz [1], which are still very challenging even with aggressive CMOS scaling [2]. Another issue associated with
ISSCC 2015
Session 25
RF & Wireless
A 2.4GHz 4mW Inductorless RF Synthesizer
Recent developments in RF receiver design have eliminated all on-chip inductors except for that used in the local oscillator. This paper addresses this “last inductor” problem and proposes an integer-N synthesizer archit
ISSCC 2015
Session 25
RF & Wireless
A 2.4GHz VCO with FOM of 190dBc/Hz at 10kHz-to2MHz Offset Frequencies in 0.13μm CMOS Using an ISF Manipulation Technique
For the last few decades, phase-noise (PN) improvement of VCOs has been an intriguing problem and remains as one of the challenges in transceiver design. PN in CMOS VCOs, especially close-in PN, greatly suffers from flic
ISSCC 2015
Session 25
RF & Wireless
A ±3ppm 1.1mW FBAR Frequency Reference with 750MHz Output and 750mV Supply
Multiple emerging wireless applications (body-worn devices and IoT, for example) will demand previously impossible thin-film form factors and low system cost. One key enabling technology for this paradigm is a new class
ISSCC 2015
Session 26
Data Converters
A 1mW 71.5dB SNDR 50MS/s 13b Fully Differential Ring-Amplifier-Based SAR-Assisted Pipeline ADC
The SAR-assisted pipeline ADC is an energy-efficient architecture for high resolution [1]. Consisting of two low-resolution charge-redistribution SAR ADCs coupled by a residue amplifier, a SAR-assisted pipeline ADC relax
ISSCC 2015
Session 26
Data Converters
A 5.5fJ/conv-step 6.4MS/s 13b SAR ADC Utilizing a Redundancy-Facilitated Background Error-Detection-and-Correction Scheme
g., 802.15.4g, need high-resolution ADCs (>10b) with very low power and MS/s sampling rates. The SAR ADC is well known for its excellent power efficiency. However, its intrinsic accuracy (DAC matching) is limited up to 1
ISSCC 2015
Session 26
Data Converters
An 800MS/s 10b/13b Receiver for 10GBASE-T Ethernet in 28nm CMOS
Nitz Saputra3, Qiongna Zhang1, Jeff Riley1, Han Yan1, Mattia Introini1, Sijia Wang1, Christopher M. Ward1, Jan Westra1, Jiansong Wan1, Klaas Bult1 Broadcom, Bunnik, The Netherlands, Broadcom, Irvine, CA, 3Qualcomm, San D
ISSCC 2015
Session 26
Data Converters
A 21fJ/conv-step 9 ENOB 1.6GS/s 2× Time-Interleaved FATI SAR ADC with Background Offset and Timing-Skew Calibration in 45nm CMOS
taken advantage of timeinterleaved (TI) architectures with low-power SAR ADCs for their sub-channels. However, given that the TI architecture needs to satisfy matching requirements between channels, the circuit complexit
ISSCC 2015
Session 26
Data Converters
A 5.5mW 6b 5GS/s 4×-Interleaved 3b/cycle SAR ADC in 65nm CMOS
Seng-Pan U1,2, R. P. Martins1,3 University of Macau, Macao, China, Synopsys, Macao, China, 3 Instituto Superior Tecnico, Universidade de Lisboa, Portugal 1 2 Communication devices such as 60GHz-band receivers and serial
ISSCC 2015
Session 26
Data Converters
A 5GS/s 150mW 10b SHA-Less Pipelined/SAR Hybrid ADC in 28nm CMOS
Rong Wu1, Hemasundar M. Geddada1, Yen-Jen Ko2, Yen Ding2, Chun-Sheng Huang2, Wei-Ta Shih2, Ming-Hung Hsieh2, Wei-Te Chou1, Tianwei Li1, Ayaskant Shrivastava1, Yi-Chun Chen1, Juo-Jung Hung1, Giuseppe Cusmai1, Jiangfeng Wu
ISSCC 2015
Session 26
Data Converters
A 2.6b/cycle-Architecture-Based 10b 1.7GS/s 15.4mW 4×-Time-Interleaved SAR ADC with a Multistep Hardware-Retirement Technique
(TI) structures, the conversion rates of ADCs have greatly improved, which has inevitably increased power consumption. Despite the advantages of TI structures, power consumption is increased due to the stricter matching
ISSCC 2015
Session 27
Sensors
A 3-Axis Gyroscope for Electronic Stability Control with Continuous Self-Test
(ESC) systems [1], which are mandated for new vehicles in many countries. Gyroscopes for ESC applications require higher performance specifications than those of consumer gyroscopes available in the market today. In addi
ISSCC 2015
Session 27
Sensors
A 1.2μg/√Hz-Resolution 0.4μg-Bias-Instability MEMS Silicon Oscillating Accelerometer with CMOS Readout Circuit
requires gm to be much larger than 1/Rs, which leads to large power overhead. The proposed subtractor in Fig. 27.2.2 utilizes a low-power OTA and a series-shunt feedback to boost the open loop gain, which makes the effec
ISSCC 2015
Session 27
Sensors
A 3-Axis Open-Loop Gyroscope with Demodulation Phase Error Correction
in high-volume applications, largely due to intuitive user interfaces in smart phones and video game controllers. For their continued expansion into more demanding CE applications, a further reduction of their noise, off
ISSCC 2015
Session 27
Sensors
A 0.8mm3 ±0.68psi Single-Chip Wireless Pressure Sensor for TPMS Applications
Jingren Gu1, Richard Ruby2, Brian P. Otis1 University of Washington, Seattle, WA, Avago Technologies, San Jose, CA 1 2 This work presents a single-chip sub-mm3 wireless pressure sensor suitable for tire pressure monitori
ISSCC 2015
Session 27
Sensors
A 30ppm <80nJ Ring-Down-Based Readout Circuit for Resonant Sensors
Resonant sensors are a promising candidates for energy-constrained applications. For instance, the resonance frequency shift of polymer-coated MEMS resonators has been used to realize electronic nose systems for personal
ISSCC 2015
Session 27
Sensors
A 0.7pF-to-10nF Fully Digital Capacitance-to-Digital Converter Using Iterative Delay-Chain Discharge
various physical quantities, including position, pressure, and concentration of certain chemicals [1-6]. Integrating capacitive sensors into a small wireless sensor system is challenging due to their large power consumpt
ISSCC 2015
Session 27
Sensors
A 0.05mm2 1V Capacitance-to-Digital Converter Based on Period Modulation
capacitance-to-digital converter (CDC) that is >9× smaller than prior CDCs with >10b resolution [1-4], and improves the energy efficiency by >10× compared to previous PM-based CDCs [1]. This is achieved with the help of
ISSCC 2015
Session 27
Sensors
A 4600μm2 1.5°C (3σ) 0.9kS/s Thermal-Diffusivity Temperature Sensor with VCO-Based Readout
Temperature sensors are widely used in microprocessors to monitor on-chip temperature gradients and hot-spots, which are known to negatively impact reliability [1-4]. Such sensors should be: 1) Small to facilitate floor
ISSCC 2015
Session 27
Sensors
A 200kS/s 13.5b Integrated-Fluxgate DifferentialMagnetic-to-Digital Converter with an Oversampling Compensation Loop for Contactless Current Sensing
such as electric motor controllers, solar panel power inverters, electric vehicle battery chargers, uninterrupted and switching mode power supplies benefit from the galvanic isolation of contactless current sensors (CCS)
ISSCC 2015
Session 3
Wireline I/O
A 28Gb/s Multi-Standard Serial-Link Transceiver for Backplane Applications in 28nm CMOS
in metro networks and data centers and pushed the serial link data rate into 25Gb/s territory, populated by such electrical interface as OIF CEI-25G, CEI-28G [1], IEEE 802.3bj 100G-KR4. To cope with severe channel impair
ISSCC 2015
Session 3
Wireline I/O
Multi-Standard 185fsrms 0.3-to-28Gb/s 40dB Backplane Signal Conditioner with Adaptive Pattern-Match 36-Tap DFE and Data-Rate-Adjustment PLL in 28nm CMOS
Norio Nakajima2, Masatoshi Tsuge2, Tatsunori Usugi2, Tomofumi Hokari2, Hideki Koba2, Takemasa Komori2, Junya Nasu2, Tsuneo Kawamata2, Yuichi Ito2, Seiichi Umai2, Jun Kumazawa2, Hiroaki Kurahashi2, Takashi Muto2, Takeo Ya
ISSCC 2015
Session 3
Wireline I/O
A 0.5-to-32.75Gb/s Flexible-Reach Wireline Transceiver in 20nm CMOS
Bruce Xu, Daniel Wu, Didem Turker, Hesam Aslanzadeh, Hiva Hedayati, Jay Im, Siok-Wei Lim, Stanley Chen, Toan Pham, Yohan Frans, Ken Chang Xilinx, San Jose, CA The introduction of high-speed backplane transceivers inside
ISSCC 2015
Session 3
Wireline I/O
A 36Gb/s PAM4 Transmitter Using an 8b 18GS/s DAC in 28nm CMOS
signaling. Serial NRZ links as high as 56Gb/s and 60Gb/s have been reported [1]. Nevertheless, as the rate increases, the constraints imposed by the channel, package, and die become more severe and do not benefit from pr
ISSCC 2015
Session 3
Wireline I/O
A 16-to-40Gb/s Quarter-Rate NRZ/PAM4 Dual-Mode Transmitter in 14nm CMOS
to data-rates of 40Gb/s and beyond. Most previous standards for these networking applications use NRZ signaling. However, practical signal integrity constraints have led to a renewed interest in also supporting PAM4 for
ISSCC 2015
Session 3
Wireline I/O
A 10Gb/s Hybrid ADC-Based Receiver with Embedded 3-Tap Analog FFE and Dynamically-Enabled Digital Equalization in 65nm CMOS
Sebastian Hoyos, Samuel Palermo control that allows all combinations ranging from all pre-cursor to all postcursor equalization taps. A loop-unrolled architecture is utilized to meet the critical feedback timing paths of
ISSCC 2015
Session 3
Wireline I/O
A 7Gb/s Rapid On/Off Embedded-Clock Serial-Link
in 65nm CMOS Tejasvi Anand1, Mrunmay Talegaonkar1, Ahmed Elkholy1, Saurabh Saxena1, Amr Elshazly2, Pavan Kumar Hanumolu1 University of Illinois, Urbana, IL, 2Intel, Hillsboro, OR 1 Energy-proportional operation of serial
ISSCC 2015
Session 3
Wireline I/O
A 0.45-to-0.7V 1-to-6Gb/s 0.29-to-0.58pJ/b Source-Synchronous Transceiver Using Automatic Phase Calibration in 65nm CMOS
greatly reduce power in serial link transceivers. Ideally, power efficiency at a given data rate can be improved by reducing VDD while increasing the number of multiplexed circuits operating in parallel at lower clock fr
ISSCC 2015
Session 4
Digital Processors
22nm Next-Generation IBM System z Microprocessor
Donald Plass2, Yuen Chan2, Sean Carey2, Gerard Salem4, Friedrich Schroeder5, Frank Malgioglio2, Guenter Mayer5, Christopher Berry2, Michael Wood2, Yiu-Hing Chan2, Mark Mayo2, John Isakson3, Charudhattan Nagarajan6, Tobia
ISSCC 2015
Session 4
Digital Processors
A 20nm 32-Core 64MB L3 Cache SPARC M7 Processor
Francis Schumacher, Venkat Krishnaswamy, Hoyeol Cho, Sudesna Dash, Robert Masleid, Chaoyang Zheng, Yuanjung David Lin, Paul Loewenstein, Heechoul Park, Vijay Srinivasan, Dawei Huang, Changku Hwang, Wenjay Hsu, Curtis McA
ISSCC 2015
Session 4
Digital Processors
Fine-Grained Adaptive Power Management of the SPARC M7 Processor
Curtis McAllister, Ha Pham, Sebastian Turullols, Jinuk Luke Shin, Yifan YangGong, Haowei Zhang Oracle, Redwood Shores, CA The goal of the power management system of Oracle’s SPARC M7 CPU [1] is to maximize the performanc
ISSCC 2015
Session 4
Digital Processors
Energy-Efficient Microserver Based on a 12-Core 1.8GHz 188K-CoreMark 28nm Bulk CMOS 64b SoC for Big-Data Applications with 159GB/s/L Memory Bandwidth System Density
Huy N. Nguyen2, Mihir Pandya2 IBM Research, Rüschlikon, Switzerland, Freescale Semiconductor, Austin, TX 1 2 MicroServers integrate an entire server motherboard into a single Server-on-aChip (SoC), excluding DRAM, NOR-bo
ISSCC 2015
Session 4
Digital Processors
The Xeon® Processor E5-2600 v3: A 22nm 18-Core Product Family
Arvind Raghavan1, Charles Morganti2, Chris Houghton1, Dan Krueger2, Olivier Franza1, Jayen Desai2, Jason Crop2, Dave Bradley2, Chris Bostak2, Sal Bhimji1, Matt Becker1 Intel, Hudson, MA, 2Intel, Fort Collins, CO 1 The ne
ISSCC 2015
Session 4
AI / ML
A 1.93TOPS/W Scalable Deep Learning/Inference Processor with Tetra-Parallel MIMD Architecture for Big-Data Applications
analysis in image retrieval with high accuracy [1]. As Fig. 4.6.1 shows, various applications, such as text, 2D image and motion recognition use DL due to its best-in-class recognition accuracy. There are 2 types of DL: