⚡ 本页包含 AI 生成的分析内容，仅供参考
本文综述了下一代智能电源技术的趋势与挑战，重点介绍了通过工艺技术创新实现复杂SoC集成的方法，包括高压接口、电源开关和传感器等模拟混合功能的集成。论文强调了“More-than-Moore”趋势下，工艺创新对产品创新的关键作用。
on-chip computing power, higher speed and more memory, a second “More-than-Moore” trend is becoming increasingly important. These strongly application-driven technologies focus on the interface between the “analog world” and powerful digital backbone systems, and aim for increasing integration of analog and hybrid functions, such as high voltage (HV) interfaces, power switches, sensors, etc. Product innovation is not only determined by circuit, architecture, software, but also significantly by processtechnology innovation. This paper focuses on the features and recent innovations in Smart Power Technologies (SPTs), driven by applications for telecom, automotive, industrial, and “smart home”. The most advanced SPTs integrate power switches capable of handling up to 100V, 10A and beyond, with embedded EEPROM/Flash,
Marnix Tack, Peter Moens, Renaud Gillon, Johan Janssens,
Stefan Van Roeyen, Jan Sevenhans AMIS, Oudenaarde, Belgium; AMIS, Vilvoorde, Belgium Besides the well-known “Moore’s Law” scaling trend, focusing on ever-more