An 11Gb/s Inductive-Coupling Link with Burst Transmission 1 1 1

📋 论文概要

该论文提出了一种采用突发传输技术的11Gb/s电感耦合链路，用于堆叠芯片之间的高速短距离无线通信，解决了电容耦合链路在通信距离增加时数据率显著下降的问题。

💡 主要创新点

• 提出基于电感耦合的突发传输机制，实现11Gb/s的高数据率，同时支持更长的通信距离（如10μm以上）。
• 通过电感耦合替代电容耦合，克服了电容耦合在远距离时接收电压大幅衰减的局限。

🏷 关键词

📄 原文摘要

solutions for highspeed short-range wireless communications between stacked chips. Figure 15.7.1 plots data rate and communication distance of the capacitive and the inductive-coupling links [1-12]. A capacitivecoupling link in 0.13μm CMOS [1] communicates at 11Gb/s for a distance of 3μm. When the communication distance is extended to 10μm, the data rate is lowered to 1.5Gb/s [6]. The capacitive-coupling link can be used only for distances shorter than 10μm for the following reason. The received voltage of the capacitive coupling link, VR,CAP, is given by VTCC/(CC+CSUB) where VT is the signal voltage in a transmitter electrode, CC is the capacitance between the electrodes, and CSUB is the capacitance between the electrode and substrate.

👥 作者与机构

Noriyuki Miura , Yoshinori Kohama , Yasufumi Sugimori ,

Hiroki Ishikuro1, Takayasu Sakurai2, Tadahiro Kuroda1 1 Keio University, Yokohama, Japan, 2University of Tokyo, Tokyo, Japan Capacitive and inductive-coupling links are circuit