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ISSCC 2008Session 32 · MEMS & SENSORSSensors1µm CMOS

Single-Chip CMOS Analog Sensor-Conditioning ICs with Integrated Electrically-Adjustable Passive Resistors

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📋 论文概要

本文提出了一种在标准1µm CMOS工艺中集成电可调无源电阻的单芯片模拟传感器调理IC,通过添加体硅腔体刻蚀实现电阻调整,避免了数字调理的功耗和面积开销,并允许系统组装者在封装后进行校准。

💡 主要创新点

工艺节点
1µm CMOS
重要性
发表年份
ISSCC 2008

🏷 关键词

模拟传感器调理电可调电阻CMOS集成MEMS后封装调整

📄 原文摘要

integration of sensors and/or MEMS with ICs for many purposes, including enhancing the performance of the ICs [1]. Post-packaging or post-assembly in-system adjustment of analog circuits is increasing in industrial importance (e.g., sensor-conditioning ICs) [2, 3]. We demonstrate single-chip analog sensor-conditioning with integrated electrically-adjustable passive resistors, allowing adjustment by the sensor-system assembler, without the drawbacks of digital conditioning. Adding a rudimentary bulk-silicon cavity-etch to a standard 1µm CMOS process enables a group of innovations for thermally-isolated adjustable resistors, called RejustorsTM [4]. The result offers continuous-valued offset-and-gain adjustment, with optional tempco adjustment (TC-offset and TCgain), without needing ADCs, DACs or EEPROMs. While th

👥 作者与机构

Leslie Landsberger, Oleg Grudin, Saed Salman, Tommy Tsang,

Gennadiy Frolov, Zhengrong Huang, Mathieu Renaud, Bowei Zhang Microbridge Technologies, Montreal, Canada Post-processing of CMOS wafers, such as bulk micromachining, enables the

分类:Sensors · 年份:ISSCC 2008