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该论文在65nm CMOS工艺上实现了一款无电感的WiMedia UWB物理层芯片，支持三个频段组（BG1、BG3、BG6），目标数据速率达480Mb/s。通过无电感设计降低了芯片面积和成本，解决了多频段UWB系统的高集成度问题。
Kundur1, Gerard van der Weide1, Ajay Kapoor1, Tian Yan Pu2, Yu Fang2, Yu Juan Wang2, Biju Joseph Mukkada2, Hong Sair Lim2, Madhu Kiran2, Chun Swee Lim2, Sorin Badiu2, Alan Chang2 1 NXP Semiconductors, Eindhoven, Netherlands ST-NXP Wireless, Singapore 2 Ultra-WideBand (UWB) is an emerging broadband wireless technology enabling data rates up to 480Mb/s. To allow world-wide operability the WiMedia Alliance addresses three frequency band groups (BGs): BG1 (3168-4752MHz), BG3 (6336-7920MHz) and BG6 (7392-8976MHz) [1]. With an application as wireless USB, highly integrated all-CMOS SoCs offer competitive advantages over less integrated approaches. A single die PHY was presented in [2], covering BG1 only and implemented in 0.13µm CMOS. In
Domine Leenaerts1, Remco van de Beek1, Jos Bergervoet1, Harish