A Telemetric Stress-Mapping CMOS Chip with 24 FET-Based Stress Sensors for Smart Orthodontic Brackets

📋 论文概要

该论文提出了一种用于智能正畸托槽的遥测应力映射CMOS芯片，集成了24个基于FET的应力传感器，能够实时监测每个牙齿所受的载荷，为矫正治疗提供数据支持。

💡 主要创新点

• 将24个基于FET的应力传感器集成到CMOS芯片中，实现高密度应力映射，用于智能牙套应用。
• 集成无线遥测功能，使得应力数据可以远程传输，便于实时监测。

🏷 关键词

📄 原文摘要

Germany 2 With ongoing miniaturization in technology and increasing complexity in assembly and packaging, stress-sensing microsystems gain importance for the evaluation of IC packages [1]. Additionally, integrated stress-sensor systems are attractive for miniaturized force and torque sensing in various fields. The chip presented here is designed for the next generation of smart brackets, i.e. intelligent orthodontic brackets serving the orthodontist with measured loads applied to each treated tooth during therapy [2]. Furthermore, wireless communication is beneficial for achieving access to harsh environments and to reduce maintenance [3], and is mandatory for clinical smart brackets. The system presented in this paper as shown in Fig. 6.3.1 generates a map of 2

👥 作者与机构

Matthias Kuhl1, Pascal Gieschke1, Daniel Rossbach1,

Sascha Alexander Hilzensauer1, Patrick Ruther1, Oliver Paul1, Yiannos Manoli1,2 1 University of Freiburg - IMTEK, Freiburg, Germany, HSG-IMIT, Villingen-Schwenningen,