⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文提出了一种基于BJT的比率式热传感器，采用32nm和22nm先进工艺，用于微处理器中的温度监测和热管理。通过解决传统热传感器在先进工艺下的精度和面积问题，实现了高精度且紧凑的片上温度检测。
Thermal sensors are used in modern microprocessors to provide information for: 1) throttling at the maximum temperature of operation, and 2) fan regulation at temperatures down to 50°C. Today’s microprocessors are thermally limited in many applications, so accurate temperature readings are essential in order to maximize performance. There are fairly large thermal gradients across the core, which vary for different instructions, so it is necessary to position thermal sensors near hot-spots. In addition, the locations of the hot-spots may not be predictable during the design phase. Thus it is necessary for hot-spot sensors to be small enough to be moved late in the design cycle or even after first Silicon. Several authors have recently demonstrated high-accuracy (0.2°C) BJT-based sensors [1-2]. However, these sensors are limited for multiple hot-spot measurement because of their size (0.1 to 0.26mm 2). Li [3] reports a small sensor at
Joseph Shor, Kosta Luria, Dror Zilberman
Intel, Yakum, Israel