A 1V 357Mb/s-Throughput TransferJetTM SoC with Embedded Transceiver and Digital Baseband in 90nm CMOS

📋 论文概要

该论文提出了首个集成收发器和数字基带的TransferJet SoC，采用90nm CMOS工艺，在1V电压下实现了357Mb/s的吞吐量。解决了短距离无线通信中高速率、低功耗和简单易用的需求，并满足各国法规对发射功率的限制。

💡 主要创新点

• 首次实现了完整的TransferJet PHY SoC，集成了收发器和数字基带。
• 在1V低电压下实现357Mb/s高吞吐量，同时保持低功耗。
• 采用DSSS-UWB技术，适应短距离通信且符合全球法规要求。

🏷 关键词

📄 原文摘要

Yasunori Aoki1, Yusuke Shinohe1, Koki Uchino1, Yuhei Hashimoto1, Fumihiro Nishiyama1, Hiroaki Miyachi1, Ikuho Nagase2, Itaru Uezono2, Rie Hisamura2, Itaru Maekawa1 Sony, Tokyo, Japan Sony Semiconductor, Kagoshima, Japan 1 2 TransferJetTM, based on DSSS-UWB, is a promising standard protocol which provides users high-speed, short-range, simple-usage, low-power and robust connectivity. Since its communication distance is limited to a few centimeters, the required TX output power is small enough to meet regulatory restrictions in many countries. This paper presents the first SoC that implements PHY and Connection Layer (CNL) functionality from the TransferJetTM and ECMA-398 standards [1,2]. All the RF building blocks as well as digital baseband are integrated including PHY, CNL and SDIO 3.0 device controller. A coupler [3] and an RF BPF are the only external components required to complete a wireless system.

👥 作者与机构

Masahisa Tamura1, Fumitaka Kondo1, Katsumi Watanabe1,