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ISSCC 2013Session 22 · SENSORS & DISPLAYSSensors

A [10°C ; 70°C] 640×480 17μm Pixel Pitch TEC-Less IR Bolometer Imager with Below 50mK and Below 4V Power Supply

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📋 论文概要

本文提出了一种无TEC(热电冷却器)的红外辐射热计成像器,采用640×480像素阵列,像素间距17μm,在10°C至70°C的温度范围内实现了低于50mK的NETD(噪声等效温差),且电源电压低于4V。通过采用电容反馈跨阻放大器(CTIA)和像素级4位偏移预校正(OPC)技术,有效补偿固定模式噪声,防止CTIA饱和,从而在宽温度范围内保持高性能。

💡 主要创新点

核心指标
NETD < 50mK, 电源电压 < 4V, 阵列640×480, 像素间距17μm
重要性
发表年份
ISSCC 2013

🏷 关键词

红外辐射热计无TECNETD偏移预校正CTIA

📄 原文摘要

bolometer’s NETD. Bertrand Dupont, Antoine Dupret, Sebastien Becker, Antoine Hamelin, Fabrice Guellec, Pierre Imperinetti, Wilfried Rabaud To compensate for the remaining FPN, offset pre-correction (OPC) is implemented: thermalized bolometers provide currents {Ioff, Ioff/2, Ioff/4, Ioff/8} that are combined according to the 4b values stored in each pixel. These pixel registers are read just before the pixels of the active row start their integration. By reducing mismatch impact before integration, OPC prevents the CTIA from saturating under thermal drift, especially at high gain. By being less sensitive to thermal drift, a low gain would enable a larger TEC-less range, but the read-out chain would intolerably degrade the output NETD. Conversely for a given TEC-less range, the OPC enables a reduction in the constraints on bolometer mismatches. This constitutes a key factor when low-cost microbolometer imagers are targeted. These properties are demonstrated by Fig. 22.8.3, which shows th

👥 作者与机构

The CTIA’s gain can be set between 5 and 70V/μA. At 30°C, such a high gain, allows for an output NETD that is only 2% higher than the intrinsic sensitive

分类:Sensors · 年份:ISSCC 2013