3D Volumetric Ultrasound Imaging with a 32×32 CMUT Array Integrated with Front-End ICs Using Flip-Chip Bonding Technology

📋 论文概要

该论文提出了一种基于32×32 CMUT阵列与前端IC通过倒装焊技术集成的3D容积超声成像系统，解决了传统2D成像依赖操作者技能和无法提供详细组织结构视图的问题。

💡 主要创新点

• 采用倒装焊技术将CMUT阵列与前端IC紧密集成，实现了高密度3D超声成像。
• 开发了32×32 CMUT阵列，支持容积成像，提高了成像分辨率和诊断能力。

🏷 关键词

📄 原文摘要

Amin Nikoozadeh1, Omer Oralkan3, Butrus T. Khuri-Yakub1 Stanford University, Stanford, CA, Texas Instruments, Santa Clara, CA, 3 North Carolina State University, Raleigh, NC 1 2 3D ultrasound imaging is becoming increasingly prevalent in the medical field. Compared to conventional 2D imaging systems, 3D imaging can provide a detailed view of tissue structures that makes diagnosis easier for the physicians. In addition, 2D image slices can be formed at various orientations to the transducer, making the examination less dependent on the skill of the sonographer. However, various challenges exist in developing a 3D imaging system, such as integration of a large number of elements, as well as post-processing of datasets received from a large number of channels. 2D transducer arrays are typically integrated with custom ICs in the probe handle to perform some intermediate beamforming and to reduce the number of cable connections to the imaging system. Capacitive micromachined ultrasonic tran

👥 作者与机构

Anshuman Bhuyan1, Jung Woo Choe1, Byung Chul Lee1, Ira Wygant2,