⚡ 本页包含 AI 生成的分析内容，仅供参考
本文提出了一种单芯片HSPA收发器，集成了全3G CMOS功率放大器，旨在减少前端组件的物料清单、PCB面积和系统成本。通过将功率放大器集成到收发器芯片中，实现了更高的集成度和更低的系统复杂度。
Peter Pfann1, Ronald Thüringer1, Martin Kastner1, Christian Pröll2, Andreas Schwarz2, Florian Mrugalla1, Jimena Saporiti2, Umut Basaran3, Andreas Langer1, Tobias D. Werth1, Timo Gossmann1, Boris Kapfelsperger1, Johann Pletzer2 Intel, Neubiberg, Germany, 2DMCE, Linz, Austria, 3AVL, Gebze, Turkey 1 The increasing complexity and cost pressure of advanced radios for mobile communication devices dictates further integration of front-end components into the transceiver (TRX) in order to reduce bill-of-material (BoM), printedcircuit-board (PCB) area and system cost. In [1] a fully-digital polar modulator is presented, which enables a SAW-less 2G/3G transmitter, in particular by solving the transmitter (TX) noise in receive (RX) band issues at various duplex distances (45/80/190/400MHz). Removing the TX SAW filter by adopting innovative transmitter topologies not only reduced the amount of external
José Moreira1, Stephan Leuschner1, Nenad Stevanovic1, Harald Pretl2,