3D Ultrasonic Fingerprint Sensor-on-a-Chip

📋 论文概要

本文提出了一种基于3D超声波的指纹传感器单芯片方案，解决了传统指纹传感器在穿透性和安全性方面的局限。通过集成CMOS读出电路与压电换能器，实现了高分辨率指纹成像。

💡 主要创新点

• 首次将3D超声波传感与指纹识别集成在同一芯片上，利用超声波穿透表面污渍的能力提高识别可靠性。
• 采用反馈电容与换能器电容匹配的读出架构，实现近似单位增益放大，并通过两步读出过程消除电路偏移。

🏷 关键词

📄 原文摘要

Xiaoyue Jiang1, Martin Lim3, Xi Li1, Eldwin Ng3, Utkarsh Singhal1, Julius M. Tsai 3, David A. Horsley2, Bernhard E. Boser1 University of California, Berkeley, CA, University of California, Davis, CA, 3Invensense, San Jose, CA The size of the feedback capacitor Cf is approximately equal to the capacitance of the transducer (35fF) resulting in approximately unity gain. Readout occurs in two steps. First, the reset switch Sres is closed and the offset of the readout circuits stored on interstage coupling capacitors that are part of the 2.5× and 20× amplifiers. In the second step, Sres is opened and the received waveform amplified for processing by the demodulator. 1 2 The increasing popularity of mobile devices such as smart phones in applications including smart payments and personal health sets a pressing need for improved security without compromised ease of use. Fingerprint recognition has emerged

👥 作者与机构

Hao-Yen Tang1, Yipeng Lu2, Fari Assaderagh3, Mike Daneman3,