Chip-Scale Electro-Optical 3D FMCW Lidar with 8μm Ranging Precision

📋 论文概要

该论文实现了一种芯片级电光3D FMCW LiDAR系统，采用电光集成技术将LiDAR微型化到芯片尺寸，解决了传统LiDAR系统体积大、精度不足的问题，实现了8μm的测距精度。

💡 主要创新点

• 首次在芯片尺度上实现电光集成FMCW LiDAR，通过片上光源和电光调制器实现微型化3D成像。
• 采用FMCW架构而非传统的脉冲或相位延迟方法，实现了8μm的高精度测距，优于毫米级精度。
• 通过电光集成和硅光工艺，大幅减小系统体积，适用于高保真3D复制等应用。

🏷 关键词

📄 原文摘要

Tae Joon Seok1, Yasuhiro Matsui3, Ming C. Wu1, Bernhard E. Boser1 University of California, Berkeley, CA, 2EPFL, Lausanne, Switzerland, Finisar, Fremont, CA 1 3 Miniaturized 3D imaging systems with sub-mm precision are of high interest for applications such as high-fidelity 3D copying. 3D cameras that employ lightdetection-and-ranging (lidar) units offer better spatial and depth resolution compared to radar- and ultrasonic-based cameras [1-5]. While depth is measured in common lidar architectures using the round-trip delay of a short pulse [3] (so-called “pulsed lidar”) or the phase-delay of an intensity envelope on continuous-wave (CW) light (“amplitude-modulated (AM)-CW lidar”) [4], these architectures require sub-picosecond timing resolution and commensurate with high power dissipation and large area for sub-millimeter depth precision. In the frequency-modulated continuous-wave (FMCW) lidar, depth information

👥 作者与机构

Behnam Behroozpour1, Phillip A. M. Sandborn1, Niels Quack1,2,