⚡ 本页包含 AI 生成的分析内容，仅供参考
该论文提出了一款2×2 WLAN与蓝牙组合SoC，采用28nm CMOS工艺，集成了片内WLAN数字电源、2G/BT SP3T开关以及蓝牙拉远抵消技术，解决了多模无线共存和功耗问题。
Renaldi Winoto1, Ashkan Olyaei1, Mohammad Hajirostam1, Wai Lau1, Xiang Gao1, Arnab Mitra1, Ovidiu Carnu1, Philip Godoy1, Luns Tee1, Hao Li1, Erdem Erdogan1, Alden Wong1, Qiang Zhu1, Timothy Loo1, Fan Zhang1, Liwei Sheng1, Donghong Cui1, Anuranjan Jha1, Xiang Li1, Wanghua Wu1, Kun-Seok Lee1, Derek Cheung1, Ka Wo Pang1, Haisong Wang2, Jiexi Liu1, Xingliang Zhao1, Daibashish Gangopadhyay1, David Cousinard2, Arvind Anumula Paramanandam1, Xiaoang Li1, Norman Liu1, Weiwei Xu1, Yuan Fang1, Xiaoyue Wang1, Randy Tsang1, Li Lin1 Marvell, Santa Clara, CA, Marvell, Etoy, Switzerland 1 2 The 2x2 wireless LAN (WLAN) + Bluetooth (BT) combo chip continues to be the most versatile product category in the wireless connectivity space. It finds usage in a wide range of applications, such as laptops, tablets, high-end smartphones, gaming consoles, set-top boxes, wireless routers and in-car/personal hot-spot devices. Digital-intensive SoCs have been relying on Moore’s law to keep the cost
Amplifier, Integrated 2G/BT SP3T Switch and BT, Pulling Cancelation