An 18.75μW Dynamic-Distributing-Bias Temperature Sensor with 0.87°C(3σ) Untrimmed Inaccuracy and 0.00946mm2 Area

📋 论文概要

提出了一种动态分布偏置温度传感器，通过动态元件匹配(DEM)技术显著改善系统失配，未修调条件下达到0.87°C(3σ)的高精度，同时功耗仅18.75μW，面积仅0.00946mm²。

💡 主要创新点

• 采用动态分布偏置(Dynamic-Distributing-Bias)技术降低功耗并提高能效
• 引入动态元件匹配(DEM)技术，将未修调3σ温度误差从20°C改善至1°C，并解决输出非单调性问题

🏷 关键词

📄 原文摘要

The overall system mismatch will be averaged out through the lowpass digital counter, and the stable output codes can be obtained. The measured differences between the cases with and without the DEM are shown in Fig. 5.9.3. The DEM improves the 3σ temperature inaccuracy significantly from 20°C to 1°C with a temperature resolution of 0.15°C per digit at 25°C. The nonmonotonic output characteristics across the temperature of certain samples are also resolved by the DEM of the device arrays within the specified matching groups. The increment of the power consumption with the DEM is about 1.4μW. 2 The temperature sensing of a chip becomes more critical with the increment of the process and circuit complexity. In advanced processes, the heating effect becomes more severe due to the thermal accumulation within the small chip

👥 作者与机构

Ying-Chih Hsu1, Chia-Liang Tai1, Mei-Chen Chuang1, Alan Roth2, Eric Soenen2

TSMC, Hsinchu, Taiwan TSMC, Austin, TX 1 to be 16 times the clock cycle