A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

📋 论文概要

该论文提出了一种用于微型3D超声探头的适配间距前端ASIC，集成了子阵列波束成形ADC，有效解决了二维换能器阵列中大量元件与有限电缆数量之间的不匹配问题。

💡 主要创新点

• 首次实现了每个换能器元件仅0.91mW功耗的适配间距前端ASIC，集成了子阵列波束成形ADC，大幅降低了数据输出通道数。
• 通过集成波束成形ADC减少了所需电缆数量，使得用于3D经食道和心内超声成像的微型探头成为可能。

🏷 关键词

📄 原文摘要

Mingliang Tan1, Hendrik J. Vos1,2, Johan G. Bosch2, Martin D. Verweij1,2, Nico de Jong1,2, Michiel A. P. Pertijs1 Delft University of Technology, Delft, The Netherlands Erasmus MC, Rotterdam, The Netherlands 1 2 Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the

👥 作者与机构

Chao Chen1, Zhao Chen1, Deep Bera2, Emile Noothout1, Zu-Yao Chang1,