A 100mK-NETD 100ms-Startup-Time 80×60 MicroBolometer CMOS Thermal Imager Integrated with a 0.234mm2 1.89μVrms Noise 12b Biasing DAC

📋 论文概要

该论文提出了一款80×60像素的微辐射热计CMOS热成像仪，实现了100mK的NETD和100ms的快速启动时间。通过集成0.234mm²面积、1.89μVrms噪声的12位ADC，在低成本非制冷条件下实现了高性能热成像。

💡 主要创新点

• 集成低噪声（1.89μVrms）、小面积（0.234mm²）的12位ADC，提升热成像信噪比。
• 实现100ms的快速启动时间，满足热成像仪快速响应的需求。
• 在80×60阵列下达到100mK的NETD，兼顾分辨率与灵敏度。

🏷 关键词

📄 原文摘要

Ji-Su Choi1, Min-Woo Ko1, Jeong-hyun Cho1, Sangjin Lim1, Hyung-Min Lee2, Hyun-Sik Kim3, Kwyro Lee1, Gyu-Hyeong Cho1 KAIST, Daejeon, Korea; 2Korea University, Seoul, Korea Dankook University, Cheonan, Korea 1 3 A micro-bolometer focal plane array (MBFPA) detector is one of the best candidates for thermal imaging cameras due to its excellent uncooled imaging performance with low manufacturing cost [1-4]. In Fig. 10.8.1, remote infra-red signals from thermal objects are maximized and absorbed at the MEMS microbolometer pixels having a λ/4 cavity structure, and they are then converted into resistance of a thermistor layer in each cell. Then, a CMOS analog front-end (AFE) reads out the cell resistance value in current-mode by applying a voltage bias to the micro-bolometer pixel. In the readout process, the skimming cell that does not respond to the infra-red signal is used to remove the offset components by

👥 作者与机构

Ki-Duk Kim1, Seunghyun Park1, Kye-Seok Yoon1, Gyeong-Gu Kang1, Hyun-Ki Han1,