A Single-Chip Optical Phased Array in a 3D-Integrated Silicon Photonics/65nm CMOS Technology

📋 论文概要

该论文实现了单片集成的光学相控阵（OPA），采用3D集成硅光子学与65nm CMOS工艺，用于激光雷达和自由空间光通信。解决了传统分立组件系统成本高、体积大、鲁棒性差的问题。

💡 主要创新点

• 首次在65nm CMOS工艺上通过3D集成实现单芯片光学相控阵，大幅降低系统尺寸和成本。
• 利用硅光子学与CMOS电路的紧密集成，提升波束控制的精度和稳定性。

🏷 关键词

📄 原文摘要

Jelena Notaros2, Ami Yaacobi2, Erman Timurdogan2, Christopher Baiocco3, Nicholas Fahrenkopf3, Seth Kruger3, Tat Ngai3, Yukta Timalsina3, Michael R. Watts2, Vladimir Stojanovic1 University of California, Berkeley, CA Massachusetts Institute of Technology, Cambridge, MA 3 Colleges of Nanoscale Science and Engineering, Albany, NY 1 2 The realization of a low-cost and robust optical beam-steering platform is a key enabler for a number of applications, including light detection and ranging (LIDAR) and free-space optical communications (FSO). Optical phased arrays (OPAs) have emerged as a promising solution, due to advancements in photonic integrated circuits (PIC) foundry processes, which have enabled high-precision fabrication of PICs with a large number of components [1-3]. In order to meet steering range and directivity requirements in systems such as autonomous vehicles, a clear path to scaling OPAs to millimeter-scale apertures with thousands

👥 作者与机构

Taehwan Kim1, Pavan Bhargava1, Christopher V. Poulton2,