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该论文提出了一种集成BAW振荡器,能够在温度、封装应力和老化条件下实现±30ppm以内的频率稳定性,适用于高产量制造。它解决了传统石英晶体振荡器在尺寸、成本和集成度方面的局限性,为物联网无线传感器节点提供了小型化、低功耗的替代方案。
Danielle Griffith1, Ernest Ting-Ta Yen2, Kaichien Tsai1, Habeeb Ur Rahman Mohammed1, Baher Haroun1, Ali Kiaei2, Ahmad Bahai2 Texas Instruments, Dallas, TX; 2Texas Instruments, Santa Clara, CA 1 Wireless sensor nodes with low power and small form factor are desirable for emerging IoT applications. These nodes usually consist of a processor, memory, radio, sensors, battery, and two quartz crystals: one at 32kHz to synchronize data transmission and the other in the MHz range to synthesize RF signals. SoC integration of the memory, processor, and radio is common; however the MHz crystal remains external, which makes up a significant portion of the entire wireless node size. MEMS resonators are logical alternatives to replace external crystals due to their miniaturization and potential to be co-packaged with the SoC. One promising technology is the bulk acoustic wave (BAW) oscillator [1]. Despite multiple
Stability Over Temperature, Package Stress, and Aging, Suitable for High-Volume Production