⚡ 本页包含 AI 生成的分析内容，仅供参考
本文提出了一款同时支持WiFi和蓝牙反向散射的组合芯片，通过全反射相控多天线实现波束赋形，解决了传统反向散射通信距离有限且缺乏BLE IC实现的问题。
*Equally-Credited Authors (ECAs) Many envisioned IoT applications are not realizable today due to the mW-level power burden of wireless communication circuits for the most popular consumer standards: WiFi and BLE. To help enable new IoT applications, WiFi backscatter communication techniques have been shown to enable a ~1,000× reduction in power consumption over conventional transceivers while maintaining WiFi standard compatibility [1-3]. However, pragmatic deployment is currently hindered by their limited range, and lack of IC implementations for BLE [4-5]. For example, [3] and [1] only operate with inter- access point (AP) distances of 16m and 21m, respectively, which is not quite sufficient for robust operation in dense office environments, or large smart warehouses or airports with larger (and therefore lower cost) inter-AP deployment distances. Since backscatter modulation is passive with no RF power amplification, additional range can only be achieved by
Shih-Kai Kuo*, Manideep Dunna*, Dinesh Bharadia, Patrick P. Mercier
University of California, San Diego, CA