THz Cryo-CMOS Backscatter Transceiver: A Contactless 4 Kelvin-300 Kelvin Data Interface

📋 论文概要

本文提出了一种基于太赫兹Cryo-CMOS的后向散射收发器，实现了4K至300K温度范围内的无接触数据接口，解决了低温大规模系统（如量子计算机）中物理连接线缆瓶颈问题。该设计利用后向散射技术避免了直接导线连接，支持低温与室温之间的高速数据传输。

💡 主要创新点

• 首次实现全CMOS的太赫兹后向散射收发器，在4K低温下工作并与室温端无线通信。
• 提出无接触数据接口方案，消除了低温-室温间大量物理线缆带来的热负载和扩展性限制。

🏷 关键词

📄 原文摘要

Muhammad Ibrahim Wasiq Khan, Xiang Yi, Dirk R. Englund, Ruonan Han Massachusetts Institute of Technology, Cambridge, MA Modern low-temperature large-scale systems, such as high-sensitivity IR/THz imaging arrays and quantum computers, require massive signal connections between the cooled system core and external room-temperature (RT) components. An error-protected quantum computer needs thousands or even millions of qubits operating at cryogenic temperature. Albeit the rapid development of highly-integrated quantum processors [1], future scalability may still be largely limited by the cables connecting the processors and peripheral control/processing units [2]; because even using low-thermal-conductivity metal materials, those cables still transport non-negligible amount of heat due to the large temperature gradient. In a dilution refrigerator, a stainless-steel UT-085-SS-SS cable could pose close to one mW of heat load to the 4K stage, and tens of mW to the

👥 作者与机构

Jinchen Wang, Mohamed I. Ibrahim, Isaac B. Harris, Nathan M. Monroe,