ISSCC 2013
Session 11
Memory
A 0.15mm-Thick Non-Contact Connector for MIPI Using Vertical Directional Coupler
capabilities should also be improved to achieve higher overall system performance. This paper proposes a new, small-size and high-speed non-contact interconnect between printed circuit boards (PCBs) using a vertical dire
ISSCC 2012
Session 2
Memory
A 7Gb/s/Link Non-Contact Memory Module for MultiDrop Bus System Using Energy-Equipartitioned Coupled Transmission Line
increases as well. Recently, the memory interface has been improved up to 20Gb/s/link [1]. Considering PCB routing area, a multi-drop bus architecture is still preferable for large memory capacity to the point-to-point c