⚡ 本页包含 AI 生成的分析内容，仅供参考
本文提出一种非接触式内存模块，采用能量均衡的耦合传输线技术，用于多分支总线系统，解决了传统多分支总线中因反射导致的性能退化问题，实现了7Gb/s/link的数据传输速率。
increases as well. Recently, the memory interface has been improved up to 20Gb/s/link [1]. Considering PCB routing area, a multi-drop bus architecture is still preferable for large memory capacity to the point-to-point connection. However, the multi-drop approach suffers from performance degradations due to reflections at each stub. To mitigate this problem, reference [2] proposes an impedance-matched bi-directional multi-drop DQ bus architecture that is difficult to realize due to smaller series resistor if more than 4 modules are used. To avoid multi-reflections from each stub, other approaches have used coupled transmission lines (CTL) [3, 4]. While a horizontal directional coupler buried in the PCB was used [3], coupled traces on the bent loop of flex fixed to a module were used
Won-Joo Yun, Shinya Nakano, Wataru Mizuhara, Atsutake Kosuge,
Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda Keio University, Yokohama, Japan As computing power and speed increases, the demand for higher memory bandwidth