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ISSCC 2013Session 11 · EMERGING MEMORY AND WIRELESS TECHNOLOGYMemory

A 0.15mm-Thick Non-Contact Connector for MIPI Using Vertical Directional Coupler

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📋 论文概要

本文提出了一种用于印刷电路板间非接触互连的垂直定向耦合器,实现了毫米级间隙的高速数据传输,并成功应用于液晶显示器驱动板。该设计通过充分利用垂直定向耦合器的特性,在单个耦合器中实现了两个信号端口,解决了传统连接器体积大、速度受限的问题。

💡 主要创新点

重要性
发表年份
ISSCC 2013

🏷 关键词

非接触连接器垂直定向耦合器MIPI

📄 原文摘要

capabilities should also be improved to achieve higher overall system performance. This paper proposes a new, small-size and high-speed non-contact interconnect between printed circuit boards (PCBs) using a vertical directional coupler (VDC), which has actually been applied to a liquid crystal display (LCD) driver board. The feasibility of a millimeter-range non-contact interface using a directional coupler was studied previously [1]. In this paper, two signal ports have been implemented in one coupler by best utilizing the characteristics of VDC. The coupler size is 5mm x 2.25mm, and the gap between the couplers is about 75µm, which corresponds to the twofold thickness of a soldering resist on PCB and the adhesive material in between. The transmitter transforms the data sequence

👥 作者与机构

Wataru Mizuhara, Tsunaaki Shidei, Atsutake Kosuge, Tsutomu Takeya,

Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda Keio University, Yokohama, Japan As silicon chip performance continues to increase, the interconnection

分类:Memory · 年份:ISSCC 2013