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ISSCC 2008Session 21 · SRAMMemory45nm high-κ metal-gate CMOS

A 153Mb-SRAM Design with Dynamic Stability Enhancement and Leakage Reduction in 45nm High-κ Metal-Gate CMOS Technology

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📋 论文概要

本文提出一种153Mb SRAM设计,采用动态正向体偏置技术增强存储单元的稳定性,并降低泄漏功耗。该设计基于45nm高κ金属栅CMOS工艺,解决了在器件变异增大和泄漏电流上升情况下的低电压操作稳定性问题。

💡 主要创新点

工艺节点
45nm high-κ metal-gate CMOS
重要性
发表年份
ISSCC 2008

🏷 关键词

SRAM动态体偏置稳定性增强泄漏降低45nm工艺

📄 原文摘要

drive the increase of on-die memory density to meet performance needs in various applications such as microprocessors. Meanwhile, the device variation and leakage are increasing as the miniaturization of the transistor continues. As a result, it is increasingly challenging to develop SRAM with adequate stability margin for low-voltage operation while keeping the power consumption low enough to meet system-level power requirements. We report a 153Mb SRAM design that is optimized for a 45nm high-κ metal-gate technology [1]. The design contains fully integrated dynamic forward-body-bias to achieve lower voltage operation while keeping low the area and power overhead. The dynamic sleep design, which was developed at the

👥 作者与机构

Fatih Hamzaoglu1, Kevin Zhang1, Yih Wang1, Hong Jo Ahn1,

Uddalak Bhattacharya1, Zhanping Chen1, Yong-Gee Ng1, Andrei Pavlov1, Ken Smits2, Mark Bohr1 1 Intel, Hillsboro, OR , 2Intel, Santa Clara, CA CMOS technology scaling continues to

分类:Memory · 年份:ISSCC 2008