⚡ 本页包含 AI 生成的分析内容,仅供参考
该论文介绍了一款在45nm SOI工艺下实现的SRAM宏单元,访问时间为450ps,采用两级体接触传感方案和动态功耗管理技术,分别实现了58%的读功耗降低和37%的漏电功耗降低。
45nm SOI technology [1]. The macro is adapted for use as the principal growable embedded-SRAM block in a 45nm ASIC library. We describe a two-stage, body-contacted sensing scheme that, among other improvements, achieves a 58% reduction in read power consumption under constant voltage and frequency compared to the previous generation macro [2]. Also described is a single-device dynamic-leakage-suppression scheme that reduces total leakage power consumption by 37% with no wake-up-cycle requirements. Figure 21.2.1 shows the SRAM macro features. SOI technology is typically exploited for high-performance processor applications [3]. To achieve the high performance, SRAM designs in SOI diverge from standard bulk offerings by eliminating sense amplifiers (SA) and limiting the number of cells on a bitline (BL) [3]. SOI technology is not limited to these high-e
Harold Pilo1, Vinod Ramadurai1, Geordie Braceras1, John Gabric1,
Steve Lamphier1, Yue Tan2 1 IBM, Essex Junction, VT, 2IBM, Hopewell Junction, NY A 450ps access-time 512Kb SRAM macro is fabricated in a