A 3MPixel Multi-Aperture Image Sensor with 0.7µm Pixels in 0.11µm CMOS

📋 论文概要

本文提出了一种采用多孔径架构的图像传感器，在0.11µm CMOS工艺中实现了3百万像素分辨率和0.7µm像素尺寸。通过集成微光学元件到每个孔径中，解决了传统图像传感器像素缩小受限于光学衍射的问题，并提升了成像能力。

💡 主要创新点

• 提出了多孔径图像传感器架构，每个子像素阵列（孔径）具有独立的集成微光学，可突破传统单孔径的光学分辨率限制。
• 在0.11µm CMOS工艺上实现了0.7µm像素尺寸，并验证了3百万像素的成像性能，展示了像素持续缩小的新方向。

🏷 关键词

📄 原文摘要

Conventional image sensors have improved with technology scaling mainly by reducing pixel size to increase spatial resolution [1,2]. As resolution approaches the limits of existing optics, is there much to gain from further pixel scaling? In [3], we argue that further scaling can provide new imaging capabilities via a multi-aperture (MA) architecture, which consists of an array of small submicron pixel imagers (apertures), each with its own integrated optics. By focusing the integrated optics onto an image plane formed by an objective lens in a region above the MA imager, the apertures capture overlapping views of the scene. The correlation and redundancy between apertures, along with computation, provide several new capabilities, including: (i) simultaneous capture of a 2D image at higher resolution than the aperture count and a 3D depth map without the need for active illumination or calibration; (ii) simplification of the objective lens design;

👥 作者与机构

Keith Fife, Abbas El Gamal, H.-S. Philip Wong

Stanford University, Stanford, CA