ISSCC 2026
Session 7
Image Sensors
A 1.09e--Random-Noise 1.5µm-Pixel-Pitch 12MP Global-Shutter-Equivalent CMOS Image Sensor with 3µm Digital Pixels Using Quad-Phase-Staggered Zigzag Readout and Motion Compensation
Gihwan Cho, Hyukbin Kwon, Jaehun Jeong, Bumjun Kim, Su-Hyun Han, Youna Lee, Hiroyuki Sugihara, Junghoon Jung, Suksan Kim, Kyungtae Lim, Wonoh Ryu, Yongjun Kim, Seung-Sik Kim, Heesung Shim, Min-Woong Seo, Jae-kyu Lee, Jon
ISSCC 2026
Session 7
Image Sensors
A 55nm Intelligent Vision SoC Achieving 346TOPS/W System Efficiency via Fully Analog Sensing-to-Inference Pipeline
presents a fully analog intelligent vision SoC that eliminates both sensorprocessor and inter-layer A/D conversions for end-to-end vision. A continuous analog datapath from sensing to multi-layer inference is enabled by
ISSCC 2026
Session 7
Image Sensors
A Fully Reconfigurable Hybrid SPAD Vision Sensor with 134dB Dynamic Range Using Time-Coded Dual Exposures
Abstract This paper presents a fully reconfigurable HDR intensity/event hybrid SPAD sensor. The fully reconfigurable scheme enables both pixel types to be freely blended and operated simultaneously. A time-coded dual exp
ISSCC 2026
Session 7
Image Sensors
A 128×96 Multimodal Flash LiDAR SPAD Imager with Object Segmentation Latency of 18μs Based on Compute-Near-Sensor Ising Annealing Machine
*Equally-Credited Authors (ECAs) Abstract This paper presents a 128×96 multimodal flash LiDAR SPAD imager integrated with a compute-near-sensor Ising-model annealing processor for dynamic object segmentation, framed as a
ISSCC 2026
Session 7
Image Sensors
A 26.0mW 30fps 400x300-pixel SWIR Ge-SPAD dToF Range Sensor with Programmable Macro-Pixels and Integrated Histogram Processing for Low-Power AR/VR Applications
Sony Semiconductor Solutions Europe, Trento, Italy, 2Sony Semiconductor Solutions, Atsugi, Japan 1 Abstract This paper presents a 400×300-pixel Ge-SPAD SWIR/NIR sensor enabling very-low-power operation: the flexible macr
ISSCC 2026
Session 7
Image Sensors
A 480×320 CMOS LiDAR Sensor with Tapering 1-Step Histogramming TDCs and Sub-Pixel Echo Resolvers
*Equally Credited Authors (ECAs) 1 Abstract A 480×320 CMOS LiDAR sensor using tapered 1-step hTDCs and SPER for memory-efficient operation is presented. The hTDC accumulates histograms with 1ns resolution over the full r
ISSCC 2026
Session 7
Image Sensors
VoxCAD: A 0.82-to-81.0mW Intelligent 3D-Perception dToF SoC with Sector-Wise Voxelization and High-Density Tri-Mode eDRAM CIM Macro
*Equally Credited Authors (ECAs) 1 Abstract VoxCAD, an intelligent low-power dToF SoC for end-to-end 3D perception applications, is presented with three features: 1) LiDAR dToF sensing-integrated 2D-ROI guided point clou
ISSCC 2026
Session 7
Image Sensors
A 200MP 0.61μm-Pixel-Pitch CMOS Imager with Sub-1e- Readout Noise Using Interlaced-Shared Transistor Architecture and On-Chip Motion Artifact-Free HDR Synthesis for 8K Video Applications
Abstract We propose a 200MP 0.61µm pixel size CMOS image sensor featuring: 1) an interlacedshared pixel architecture to achieve a 0.7e- readout noise, 2) an on-chip motion artifact-free HDR synthesis with single-frame dy
ISSCC 2026
Session 7
Image Sensors
54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation
Duncan Hall1, Axel Crocherie1, Cedric Pastorelli1, Sophie Taupin2, Severin Trochut2, Abhishek Singh1, Andreas Assmann1, Bruce R. Rae1, Pascal Mellot2 STMicroelectronics, Edinburgh, United Kingdom, 2STMicroelectronics, Gr
ISSCC 2025
Session 6
Image Sensors
A Compact 10b Source Driver IC with Delta-Sigma Pulse Width Modulation for Low-Voltage Digital Interpolation Achieving 1884µm2/Channel
flagship smartphones has contributed to better quality 3D image rendering and mobile gaming applications. However, high-resolution displays require source-driver ICs (SD-IC) with more channels, significantly increasing t
ISSCC 2025
Session 6
Image Sensors
A Real-Time Pixel-Compensated Source-Driver IC with Dual-Slope Error Detection and Multi-Channel Time-Multiplexing Compensator for Compact OLED Displays
Active-matrix organic light-emitting diode (AMOLED) displays, especially those using lowtemperature polycrystalline silicon (LTPS) thin-film transistors (TFTs), have been widely used in mobile devices thanks to their hig
ISSCC 2025
Session 6
Image Sensors
A 10b Source-Driver IC with All-Channel Automatic Offset Calibration and Slew-Rate-Enhanced Amplifier Achieving 2273μm2/Channel and 1.9mV DVO for 6285-PPI OLED-on-Silicon Displays
*Equally Credited Authors (ECAs) Recent microdisplays for augmented reality (AR) and virtual reality (VR) devices face distinct technical challenges compared to traditional displays, with the essential requirements being
ISSCC 2025
Session 6
Image Sensors
A 320×256 6.9mW 2.2mK-NETD 120.4dB-DR LW-IRFPA with Pixel-Paralleled Light-Driven 20b Current-to-Phase ADC
Technical Physics Chinese Academy of Sciences, Shanghai, China 1 2 Long-wavelength (LW) cryogenic (from 80 down to 40K) infrared focal plane arrays (IRFPAs) are extensively employed because of their sensitivity and rapid
ISSCC 2025
Session 6
Image Sensors
A 25.2Mpixel 120frames/s Full-Frame Global-Shutter CMOS Image Sensor with Pixel-Parallel ADC
(RS) currently dominate the market for consumer cameras, particularly interchangeable lens cameras (ILCs). Despite their widespread use, conventional sensors with RS, such as [1], have limitations in image expression due
ISSCC 2025
Session 6
Image Sensors
A 400×400 3.24µm 117dB-Dynamic-Range 3-Layer Stacked Digital Pixel Sensor
Song Chen1, Zhao Wang4, Chiao Liu1, Yi-Hsuan Lin2, Sheng-Yeh Lai2, Hao-Ming Hsu2, Hirofumi Abe5, Kazuya Mori5, Hideyuki Fukuhara5, Chih-Hao Lin2, Toshiyuki Isozaki5, Wei-Chen Li2, Wei-Fan Chou2, Masayuki Uno5, Rimon Iken
ISSCC 2025
Session 6
Image Sensors
SPAD Flash LiDAR with Chopped Analog Counter for 76m Range and 120klx Background Light
Korea 5 Samsung Electronics, Hwasung, Korea 1 2 Flash LiDAR sensors are becoming increasingly important in many automotive, space, and robotic applications. However, achieving long range, high depth resolution, and high
ISSCC 2025
Session 6
Image Sensors
An Asynchronous 160×90 Flash LiDAR Sensor with Dynamic Frame Rates of 5 to 250fps Based on Pixelwise ToF Validation via a Background-Light-Adaptive Threshold
Sogang University, Seoul, Korea 1 2 Over the past few decades, LiDAR technology has become a cornerstone in various fields, including autonomous vehicles, augmented reality, and robotics. Unlike traditional scanning LiDA
ISSCC 2025
Session 6
Image Sensors
A 10.5mW Automotive Touch AFE IC Featuring Radiated EMI Reduction Based on Pipelined Dual-Frequency Modulation and Sine2 Waveform Shaping for CISPR 25 Class 5 Compliance
Samsung Electronics, Hwaseong, Korea 1 2 Recent automobiles increasingly incorporate touch-screen interfaces instead of traditional buttons and knobs. These automotive touch-screen sensors offer versatile functionality a
ISSCC 2025
Session 6
Image Sensors
A 3-Stacked Hybrid-Shutter CMOS Image Sensor with Switchable 1.2µm-Pitch 50Mpixel Rolling Shutter and 2.4µm-Pitch 12.5Mpixel Global Shutter Modes for Mobile Applications
Yongjun Kim, Sanggwon Lee, Sungbong Park, Daehee Bae, Si Gyoung Koo, Masamichi Ito, Jae-hoon Jeon, Sol Yoon, Sung-Jae Byun, Sangyoon Kim, KwanSik Kim, Gihwan Cho, Joonho Lee, Tekyou Kim, Sungjae Jun, Jae-kyu Lee, Chang-R
ISSCC 2024
Session 6
Image Sensors
A 256×192-Pixel 30fps Automotive Direct Time-of-Flight LiDAR
Position/Width Converter, and Intensity/CNN-Guided 3D Inpainting Chaorui Zou1, Yaozhong Ou1, Yan Zhu1, R. P. Martins1,2, Chi-Hang Chan1, Minglei Zhang1 University of Macau, Macau, China Instituto Superior Tecnico/Univers
ISSCC 2024
Session 6
Image Sensors
A 160×120 Flash LiDAR Sensor with Fully Analog-Assisted InPixel Histogramming TDC Based on Self-Referenced SAR ADC
surrounding objects plays a crucial role in realizing the metaverse and spatial computing on mobile devices. A LiDAR sensor based on direct time-of-flight (dToF) technology is one of the strong candidates to provide depth
ISSCC 2024
Session 6
Image Sensors
Withdrawn by ISSCC 110 • 2024 IEEE International Solid-State Circuits Conference 979-8-3503-0620-0/24/$31.00 ©2024 IEEE ISSCC 2024 / February 19, 2024 / 3:35 PM 6 DIGEST OF TECHNICAL PAPERS • 111
ISSCC 2024
Session 6
Image Sensors
A 0.5°-Resolution Hybrid Dual-Band Ultrasound Imaging SoC for UAV Applications
rate (more pronounced for closer objects) and enhanced image clarity (Fig. 6.5.3(d)). Jiaqi Guo1, Junwei Feng1, Silin Chen1, Liuhao Wu1, Chne-Wuen Tsai1,2, Yingna Huang1, Bochi Lin1, Jerald Yoo1,2 To feed sufficient power
ISSCC 2024
Session 6
Image Sensors
A Resonant High-Voltage Pulser for Battery-Powered Ultrasound Devices
patch are promising for next-generation health monitoring. They have the potential to enable impactful applications such as blood-pressure, cardiac, bladder, and respiratory monitoring. Research in this area to date has
ISSCC 2024
Session 6
Image Sensors
Imager with In-Sensor Event Detection and Morphological Transformations with 2.9pJ/pixel×frame Object Segmentation FOM for Always-On Surveillance in 40nm
Relentless power reductions in always-on untethered imagers for distributed vision are required to fit the power budgets available from their tightly constrained energy sources. As an effective approach to reduce power, e
ISSCC 2024
Session 6
Image Sensors
An Ultrasound-Powering TX with a Global Charge-Redistribution Adiabatic Drive Achieving 69% Power Reduction and 53° Maximum Beam Steering Angle for Implantable Applications
Robert Ukropec3, Pieter Gijsenbergh3, Veronique Rochus3, Nick Van Helleputte3, Wouter Serdijn2, Yao-Hong Liu1,2 imec, Eindhoven, The Netherlands Delft University of Technology, Delft, The Netherlands 3 imec, Leuven, Belg
ISSCC 2024
Session 6
Image Sensors
A 320x240 CMOS LiDAR Sensor with 6-Transistor nMOS-Only SPAD Analog Front-End and Area-Efficient Priority Histogram Memory
Credited Authors (ECAs) 1 2 Light detection and ranging (LiDAR) systems measure distance with high depth resolution while providing images with the shape of objects. For long-range detection, emitting a concentrated lase
ISSCC 2024
Session 6
Image Sensors
A 1/1.56-inch 50Mpixel CMOS Image Sensor with 0.5μm pitch Quad Photodiode Separated by Front Deep Trench Isolation
Taehoon Kim, Seungju Seo, Dongmo Im, You-Na Lee, Jinyong Choi, Sunghyun Yoon, Inho Noh, Jinhyung Kim, Khang June Lee, Hyesung Jung, Jongyoon Shin, Hyuk Hur, Kyoung eun Chang, Incheol Cho, Kieyoung Woo, Byung Seok Moon, J
ISSCC 2024
Session 6
Image Sensors
12Mb/s 4×4 Ultrasound MIMO Relay with Wireless Power and Communication for Neural Interfaces
Neural interfaces, including retinal and brain implants, require increasing postcompression uplink data rates >10Mb/s to send data from larger and denser recording arrays. In retinal implants, electrical recording data f
ISSCC 2023
Session 5
Image Sensors
Dual-Port CMOS Image Sensor with Regression-Based HDR Flux-to-Digital Conversion and 80ns Rapid-Update Pixel-Wise Exposure Coding
Motasem A. Sakr, Xiaonong Sun, David B. Lindell, Kiriakos N. Kutulakos, Roman Genov University of Toronto, Toronto, Canada Today’s best consumer cameras typically use computational imaging techniques to digitally enhance
ISSCC 2023
Session 5
Image Sensors
55pW/pixel Peak Power Imager with Near-Sensor Novelty/Edge Detection and DC-DC Converter-Less MPPT for Purely Harvested Sensor Nodes
*Equally Credited Authors (ECAs) Cost and form factor reductions in CMOS imagers are enabling the deployment of increasingly distributed vision sensor systems. Due to battery cost and size, aggressive power reductions ar
ISSCC 2023
Session 5
Image Sensors
A 400×200 600fps 117.7dB-DR SPAD X-Ray Detector with Seamless Global Shutter and Time-Encoded Extrapolation Counter
overflow, and hence an active reset is implemented with a reset transistor MAQ and the pixel supply voltage VPIX (=3.3V), a higher voltage than VEX. The buffered SPAD output φSPAD is fed to either counter A or B via inpu
ISSCC 2023
Session 5
Image Sensors
A 16.4kPixel 3.08-to-3.86THz Digital Real-Time CMOS Image Sensor with 73dB Dynamic Range
Terahertz (THz) imaging has promising applications in chemical and biomedical systems, industrial defect inspection, security screening, and radio astronomy owing to its favorable resolution and nondestructive features [
ISSCC 2023
Session 5
Image Sensors
A 0.64µm 4-Photodiode 1.28µm 50Mpixel CMOS Image Sensor with 0.98e- Temporal Noise and 20Ke- Full-Well Capacity Employing Quarter-Ring Source-Follower
Byeongjun Yoo, Jueun Park, Seyoung Kim, June-Mo Koo, Sewon Seo, Hye Ji Shin, Younghwan Choi, Jinwoo Kim, Kyungil Kim, Jae-Hoon Seo, Seunghyun Lim, Taesub Jung, Howoo Park, Sangil Jung, Juhyun Ko, Kyungho Lee, JungChak Ah
ISSCC 2023
Session 5
Image Sensors
A 2.97µm-Pitch Event-Based Vision Sensor with Shared Pixel Front-End Circuitry and Low-Noise Intensity Readout Mode
Toshio Terano1, Kenichi Takamiya1, Yasutaka Kimura1, Kyoji Mizoguchi1, Takahiro Miyazaki1, Shun Kaizu1, Hirotsugu Takahashi1, Atsushi Suzuki1, Christian Brandli2, Hayato Wakabayashi1, Yusuke Oike1 Sony Semiconductor Solu
ISSCC 2023
Session 5
Image Sensors
µm 35.6Mpixel RGB Hybrid Event-Based Vision Sensor with 4.88µm-Pitch Event Pixels and up to 10K Event Frame Rate by Adaptive Control on Event Sparsity
Kyoji Mizoguchi1, Takahiro Miyazaki1, Masahiro Tsukamoto1, Yoshihisa Matoba1, Hirotaka Shinozaki1, Atsumi Niwa1, Tetsuji Yamaguchi1, Christian Brandli2, Hayato Wakabayashi1, Yusuke Oike1 Sony Semiconductor Solutions, Ats
ISSCC 2023
Session 5
Image Sensors
A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1MPixel EVS with
Menghan Guo1, Shoushun Chen1, Zhe Gao2, Wenlei Yang1, Peter Bartkovjak2, Qing Qin2, Xiaoqin Hu1, Dahei Zhou1, Masayuki Uchiyama2, Yoshiharu Kudo3, Shimpei Fukuoka3, Chengcheng Xu2, Hiroaki Ebihara2, Andy Wang2, Peiwen Ji
ISSCC 2021
Session 7
Image Sensors
1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64µm Unit Pixels Separated by Full-Depth Deep-Trench Isolation
DongHyun Kim, Beomsuk Lee, SungIn Kim, Ho-Chul Ji, DongMo Im, Haeyong Park, Jinyoung Kim, JungHo Cha, Taehoon Kim, In-Sung Joe, Soojin Hong, Chongkwang Chang, Jingyun Kim, WooGwan Shim, Taehee Kim, Jamie Lee, Donghyuk Pa
ISSCC 2021
Session 7
Image Sensors
A 1-inch 17Mpixel 1000fps Block-Controlled Coded-Exposure Back-Illuminated Stacked CMOS Image Sensor for Computational Imaging and Adaptive Dynamic Range Control
In recent developments, image sensors are no longer simply a means for collecting optical signals, but rather, are increasingly expected to serve as intelligent systems with surrounding configurations. Coded exposure (CE
ISSCC 2021
Session 7
Image Sensors
A 0.2-to-3.6TOPS/W Programmable Convolutional Imager SoC with In-Sensor Current-Domain Ternary-Weighted MAC Operations for Feature Extraction and Region-of-Interest Detection
Mixed-signal vision chips are becoming increasingly popular for low-power embedded computer vision applications on smartphones, wearables and IoT nodes, as they meet stringent power and area constraints while maintaining
ISSCC 2021
Session 7
Image Sensors
A High-Speed Back-Illuminated Stacked CMOS Image Sensor with Column-Parallel kT/C-Cancelling S&H and Delta-Sigma ADC
Takashi Moue1, Daisuke Yamazaki1, Kazutoshi Kodama1, Masafumi Okano1, Takafumi Morikawa1, Kazuyoshi Yamashita1, Osamu Oka2, Itai Shvartz3, Golan Zeituni3, Ariel Benshem3, Noam Eshel3, Yoshiaki Inada1 Sony Semiconductor S
ISSCC 2021
Session 7
Image Sensors
A 250fps 124dB Dynamic-Range SPAD Image Sensor Stacked with Pixel-Parallel Photon Counter Employing Sub-Frame Extrapolating Architecture for Motion Artifact Suppression
Yasuhisa Tochigi1, Yoshiaki Tashiro1, Fumiaki Sano1, Yusuke Murakawa2, Makoto Nakamura2, Yusuke Oike1 Sony Semiconductor Solutions, Kanagawa, Japan Sony Semiconductor Manufacturing, Nagasaki, Japan 1 2 Photon-count imagi
ISSCC 2021
Session 7
Image Sensors
A 256×128 3D-Stacked (45nm) SPAD FLASH LiDAR with 7-Level Coincidence Detection and Progressive Gating for 100m Range and 10klux Background Light
Augusto R. Ximenes4, Myung-Jae Lee5, Edoardo Charbon1 EPFL, Neuchâtel, Switzerland ADAPS Photonics, Shenzhen, China 3 Intuitive Surgical, Aubonne, Switzerland 4 Facebook, Redmond, WA 5 Korea Institute of Science and Tech
ISSCC 2021
Session 7
Image Sensors
A 189×600 Back-Illuminated Stacked SPAD Direct Time-of-Flight Depth Sensor for Automotive LiDAR Systems
Kenichi Tayu1, Keitaro Amagawa2, Tomohiro Matsukawa1, Osamu Ozawa1, Daisuke Hirono1, Yasuhiro Shinozuka1, Ryutaro Homma1, Kumiko Mahara2, Toshio Ohyama1, Yousuke Morita1, Shohei Shimada1, Takahisa Ueno3, Akira Matsumoto1
ISSCC 2021
Session 7
Image Sensors
A 48×40 13.5mm Depth Resolution Flash LiDAR Sensor with In-Pixel Zoom Histogramming Time-to-Digital Converter
diverse applications such as user identification, interactive user interfaces with AR/VR devices, and self-driving cars. Direct time-of-flight (D-ToF) systems, LiDAR sensors, are desirable for long-distance measurements
ISSCC 2021
Session 7
Image Sensors
A 4-tap 3.5µm 1.2Mpixel Indirect Time-of-Flight CMOS Image Sensor with Peak Current Mitigation and Multi-User Interference Cancellation
Bumsik Chung, Sooho Son, Hoyong Lee, Heeyoung Jo, Seung-Chul Shin, Sunjoo Hong, Jaeil An, Yonghun Kwon, Sungyoung Seo, Sunghyuck Cho, Youngchan Kim, Young-Gu Jin, Youngsun Oh, Yitae Kim, JungChak Ahn, Kyoungmin Koh, Yong
ISSCC 2021
Session 34
Image Sensors
An Energy-Replenishing Ultrasound Pulser with 0.25CV2f Dynamic Power Consumption
Daegu Catholic University Medical Center, Daegu, Korea 4 Daegu Gyeongbuk Institute of Science and Technology, Daegu, Korea 5 New York University Abu Dhabi, Abu Dhabi, United Arab Emirates leads to the end of Φ1 by turnin
ISSCC 2021
Session 34
Image Sensors
A 32×32 Pixel 0.46-to-0.75THz Light-Field Camera SoC in 0.13µm CMOS
Robin Zatta, Ullrich R. Pfeiffer University of Wuppertal, Wuppertal, Germany Light-field (LF) refers to the spatio-directional light flow in space. In LF imaging, light rays are recorded along different positions and dir
ISSCC 2021
Session 34
Image Sensors
A 21pJ/frame/pixel Imager and 34pJ/frame/pixel Image Processor for a Low-Vision Augmented-Reality Smart Contact Lens the duration of Φ1 in 4- and 6-bit modes while still meeting the PGA settling accuracy. The ADC sampling capacitor array embeds an analog offset subtraction technique to calibrate accumulated offset errors and adjust the pixel black level prior to signal quantization.
Figure 34.2.3 shows the imager characterization results. The core imager energy consumption per frame remains relatively flat across a wide range of frame rates. This is achieved by powering down the imager during idle p
ISSCC 2021
Session 34
Image Sensors
An 8960-Element Ultrasound-on-Chip for Point-of-Care Ultrasound
Sewook Hwang1, Joseph Lutsky1, Jungwook Yang1, Liewei Bao1, Leung Kin Chiu1, Graham Peyton1, Hamid Soleimani1, Bob Ryan1, J. R. Petrus1, Youn-Jae Kook1, Tyler S. Ralston2, Keith G. Fife2, Jonathan M. Rothberg2 Butterfly
第 1/4 页 · 共 184 篇 · 下一页 →