A 32×32 Pixel 0.46-to-0.75THz Light-Field Camera SoC in 0.13µm CMOS

📋 论文概要

该论文提出了一款基于0.13µm CMOS工艺的32×32像素太赫兹光场相机SoC，工作频率为0.46至0.75THz。通过将光场成像概念扩展到太赫兹波段，实现了实时3D透视成像，解决了传统太赫兹成像系统体积大、成本高的问题。

💡 主要创新点

• 首次将光场成像原理应用于太赫兹频段，实现单芯片3D透射成像。
• 采用32×32像素阵列和宽频带设计（0.46-0.75THz），在标准CMOS工艺中实现太赫兹探测与信号处理集成。

🏷 关键词

📄 原文摘要

Robin Zatta, Ullrich R. Pfeiffer University of Wuppertal, Wuppertal, Germany Light-field (LF) refers to the spatio-directional light flow in space. In LF imaging, light rays are recorded along different positions and directions, and a 3-D scene is reconstructed with back-propagation [1]. Modern visible-light LF cameras assemble a lens array atop a megapixel (Mpx) count focal-plane array (FPA), such that each lens (macro-pixel) provides spatial sampling while the FPA pixels within a lens (sub-pixels) provide angular sampling [2]. Likewise, THz LF cameras can allow real-time 3D seethrough imaging for inspection and screening applications [3]. Unfortunately, THz Mpx FPAs are infeasible as a large THz pixel area (>10× visible-light pixel) would require wafer-scale FPA fabrication, leading to impractical costs and process variations. Multichip packaging is an alternative for scaling the THz FPA pixel count, but it requires

👥 作者与机构

Ritesh Jain, Philipp Hillger, Janusz Grzyb, Eamal Ashna, Vishal Jagtap,