⚡ 本页包含 AI 生成的分析内容，仅供参考
本文提出了一款用于增强现实（AR）和虚拟现实（VR）的400×400分辨率、3.24µm像素间距、117dB动态范围的3层堆叠数字像素传感器（DPS）。通过三层堆叠结构实现了高动态范围和小像素尺寸，解决了传统图像传感器在AR/VR应用中动态范围不足和像素尺寸大的问题。
Song Chen1, Zhao Wang4, Chiao Liu1, Yi-Hsuan Lin2, Sheng-Yeh Lai2, Hao-Ming Hsu2, Hirofumi Abe5, Kazuya Mori5, Hideyuki Fukuhara5, Chih-Hao Lin2, Toshiyuki Isozaki5, Wei-Chen Li2, Wei-Fan Chou2, Masayuki Uno5, Rimon Ikeno5, Masato Nagamatsu5, Guang Yang2, Shou-Gwo Wuu2, Lyle Bainbridge6 Meta, Redmond, WA Brillnics, Hsinchu, Taiwan 3 Meta, Zürich, Switzerland 4 Meta, Burlingame, CA 5 Brillnics, Tokyo, Japan 6 Sesame AI, San Francisco, CA 1 2 In recent years, digital pixel sensors (DPS) have been developed for augmented reality (AR) glasses and virtual reality (VR) headsets. Thanks to a 2-layer stacked process, DPS provides low power consumption, high dynamic range (HDR) and global shutter in a small pixel size [1,2]. To meet the increasingly important form factor and performance requirements of these devices, a 3-layer stacked DPS with a 3.24μm pixel is developed to reduce the chip size while incorporating a frame averaging unit (FAU), image signal processing (ISP), and
Tsung-Hsun Tsai1, Kwuang-Han Chang2, Andrew Berkovich1, Raffaele Capoccia3,