54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation

📋 论文概要

本文报道了一款54×42分辨率、基于SPAD的LiDAR接收器SoC，采用3D堆叠65/40nm工艺。芯片集成了高频TDC、双计数器（用于飞行时间和强度曝光）以及外围存储器，实现片上点云生成与HDR管理，并采用混合片上/封装内嵌的25V升压转换器。

💡 主要创新点

• 首次在LiDAR SoC中采用3D堆叠65/40nm技术，实现高密度像素级TDC和计数器集成。
• 片上集成点云处理与HDR管理，减少片外数据传输和系统功耗。
• 混合片上与封装内嵌的25V升压转换器，兼顾小型化与高效供电。

🏷 关键词

📄 原文摘要

Duncan Hall1, Axel Crocherie1, Cedric Pastorelli1, Sophie Taupin2, Severin Trochut2, Abhishek Singh1, Andreas Assmann1, Bruce R. Rae1, Pascal Mellot2 STMicroelectronics, Edinburgh, United Kingdom, 2STMicroelectronics, Grenoble, France 1 Abstract We report a 54×42-resolution SPAD-based LIDAR receiver SoC leveraging 3D-stacked 65/40nm technology with high-frequency TDC and 2 counters for ToF and intensity exposure, with peripheral memories used for image signal processing (ISP) frame stores, point cloud generation & HDR management. A hybrid on-chip & package-embedded 25V boost converter is described integrating SPAD supply generation synchronized with sensor frame timing. The sensor is integrated in a LIDAR module for 9.6m ranging with <1cm error. Time of Flight (ToF) or Light Detection and Ranging (LIDAR) devices are in widespread use for scene mapping and machine vision tasks. ToF receivers sensor arrays utilising CMOS

👥 作者与机构

Neale A. W. Dutton1, Xavier Branca2, Mathieu Thivin2, Steven Collins1, Herve Thuaire2, Fabrice Martin2, Vincent Clemencon2, Mohammed Al-Rawhani1,