A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1MPixel EVS with

📋 论文概要

该论文提出了一种3-wafer堆叠的混合图像传感器，集成了15MPixel的CMOS图像传感器(CIS)和1MPixel的事件视觉传感器(EVS)，实现了4.6GEvent/s的高速读出。通过像素内TDC和片上ISP/ESP功能，解决了同时获取高分辨率图像和事件流的问题。

💡 主要创新点

• 采用3-wafer堆叠架构，将CIS和EVS集成在同一芯片上，实现高分辨率图像与高速事件同步采集。
• 像素内集成TDC（时间数字转换器），支持4.6GEvent/s的事件读出速率。
• 片上集成ISP（图像信号处理）和ESP（事件信号处理）功能，提升系统集成度和处理效率。

🏷 关键词

📄 原文摘要

Menghan Guo1, Shoushun Chen1, Zhe Gao2, Wenlei Yang1, Peter Bartkovjak2, Qing Qin2, Xiaoqin Hu1, Dahei Zhou1, Masayuki Uchiyama2, Yoshiharu Kudo3, Shimpei Fukuoka3, Chengcheng Xu2, Hiroaki Ebihara2, Andy Wang2, Peiwen Jiang2, Bo Jiang2, Bo Mu2, Huan Chen1, Jason Yang2, TJ Dai2, Andreas Suess2 OmniVision Technologies, Shanghai, China 2 OmniVision Technologies, Santa Clara, CA 3 OmniVision Technologies, Yokohama, Japan 1 Event Vision Sensors (EVS) determine, at pixel level, whether a temporal contrast change beyond a predefined threshold is detected [1-6]. Compared to CMOS image sensors (CIS), this new modality inherently provides data-compression functionality and hence, enables high-speed, low-latency data capture while operating at low power. Numerous applications such as object tracking, 3D detection, or slow-motion are being researched based on EVS [1]. Temporal contrast detection is a relative measurement and is encoded

👥 作者与机构

4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP, Function