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本文介绍了第三代16核32线程SPARC处理器的物理实现,该处理器针对高性能服务器优化,兼顾单线程与多线程应用。通过内存阵列、寄存器文件和浮点硬件的电路创新来提升性能。
Yannis Orginos, Sudhendra Parampalli, Mark Steigerwald, Shriram Gundala, Rambabu Pyapali, Leonard Rarick, Ilyas Elkin, Yuefei Ge, Ishwar Parulkar Sun Microsystems, Santa Clara, CA This third-generation chip-multithreading (CMT) SPARC processor is targeted for high-performance servers, and is optimized for both single- and multi-threaded applications. The architecture highlights are provided in [1], while this paper focuses on the physical implementation aspects, providing an overview of circuit innovations in memory arrays, register files, and floating-point hardware that boost the performance and circuit robustness with low area overhead. The 396mm2 chip, shown in Fig. 4.2.1, is fabricated in a 11M 65nm CMOS process and operates at a nominal frequency of 2.3GHz, consuming a maximum power of 250W at 1.2V. Power-management techniques include clock gating at corecluster level and power throttling through a single-thread-issue
Georgios Konstadinidis, Mamun Rashid, Peter F. Lai, Yukio Otaguro,