← 返回论文列表 📄 下载原文 PDF  ISSCC 2009 · 27.4
ISSCC 2009Session 27 · SRAM AND EMERGING MEMORYMemory90nm

A 90nm 12ns 32Mb 2T1MTJ MRAM

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

该论文提出了一款90nm工艺下12ns访问时间的32Mb 2T1MTJ MRAM,通过改进单元占用率和局部电流沉电路解决了远距离写入电流衰减问题。

💡 主要创新点

核心指标
12ns访问时间,32Mb容量
工艺节点
90nm
重要性
发表年份
ISSCC 2009

🏷 关键词

MRAM2T1MTJ局部电流沉

📄 原文摘要

Y. Kato1, K. Mori1, Y. Ozaki2, Y. Kobayashi2, N. Ohshima1, K. Kinoshita1, T. Suzuki1, K. Nagahara1, N. Ishiwata1, K. Suemitsu1, S. Fukami1, H. Hada1, T. Sugibayashi1, N. Kasai1 NEC, Sagamihara, Japan, 2NEC Electronics, Sagamihara, Japan improving the cell occupation ratio. However, the conducting current through the memory cell decreases at a location far from the write driver because of the resistance of the write bitlines. To reduce parasitic resistance of the sink side, our previously published local-current-sink circuits are arranged between each sub-array. The current-sink circuits suppress the decrease of the conducting current, but the suppression is not sufficient when a boosted wordline technique is used. 1 Since MRAM cells have unlimited write endurance, they can be used as substitutes for DRAMs or SRAMs. MRAMs in electronic appliances enhance their convenience and energy efficiency because data in MRAMs are nonvolatile

👥 作者与机构

R. Nebashi1, N. Sakimura1, H. Honjo1, S. Saito1, Y. Ito2, S. Miura1,

分类:Memory · 年份:ISSCC 2009