Optical I/O Technology for Tera-Scale Computing

📋 论文概要

该论文探讨了未来多核处理器对芯片间I/O带宽的巨大需求（200GB/s至1.0TB/s），指出传统电互联技术在带宽、成本和信号完整性方面的局限，提出利用光学I/O技术实现太赫兹级计算。

💡 主要创新点

• 提出以光学互联替代电互联，解决传统芯片间通信的带宽瓶颈问题。
• 针对未来多核处理器和存储器接口的高带宽需求，设计光I/O架构以实现低损耗、长距离传输。

🏷 关键词

📄 原文摘要

to many-core will drive increased chip-to-chip I/O bandwidth demands at processor/memory interfaces and in multi-processor systems. Future architectures will require bandwidths of 200GB/s to 1.0TB/s and will bring about the era of tera-scale computing. To meet these bandwidth demands, traditional electrical interconnect techniques require increases in circuit complexity and costlier materials. However, without lower loss electrical interconnects, this method of increasing I/O bandwidth in electrical links eventually comes at the cost of reducing interconnect link length, reducing signal integrity or increasing power consumption. Optical interconnect with its terahertz bandwidth, low loss, and low cross-talk has been proposed to replace electrical interconnect between chips

👥 作者与机构

Ian Young, Edris Mohammed, Jason Liao, Alexandra Kern,

Samuel Palermo, Bruce Block, Miriam Reshotko, Peter Chang Intel, Hillsboro, Oregon The microprocessor architecture transition from multi-core