Chip Scale Camera Module (CSCM) Using ThroughSilicon-Via (TSV)

📋 论文概要

该论文提出了一种基于硅通孔（TSV）技术的芯片级相机模块（CSCM），应用于手机摄像头。通过TSV三维集成技术，成功实现了相机模块体积缩小55%、占用面积缩小36%，解决了传统相机模块尺寸过大的问题。

💡 主要创新点

• 将TSV技术应用于CMOS图像传感器相机模块，实现三维异构集成。
• 显著减小相机模块的体积和占用面积，分别降低55%和36%。

🏷 关键词

📄 原文摘要

Nishimura, Kazumasa Tanida, Kazutaka Akiyama, Masahiro Sekiguchi, Mie Matsuo, Satoru Fukuchi, Katsutomu Takahashi Toshiba Semiconductor, Yokohama, Japan No one doubts that Through Silicon Via (TSV) is one of the necessary technologies for three-dimensional integration of LSIs. Heterogeneous system integration is a good candidate for its application, which includes the “Vision Chip” [1]. TSV technology is applied to a CMOS imager sensor camera module for mobile handsets and successfully achieves a size reduction of 55% in volume and 36% in footprint, which we refer to as a Chip Scale Camera Module (CSCM). To the best of our knowledge, CSCM is the first mass-produced product using TSV technology. Issues in SiP application of TSV are: (1) high cost, (2) yield management, the so-called “known good die” (KGD) issue, and (3) ESD protection. In addition, (4) the implementation of high-speed I/Os, is an important issue for the image

👥 作者与机构

Hiroshi Yoshikawa, Atsuko Kawasaki, Tomoaki, Iiduka, Yasushi