⚡ 本页包含 AI 生成的分析内容,仅供参考
本文提出一款单芯片多频段WCDMA/HSDPA/HSUPA/EGPRS收发器,集成分集接收机和3G DigRF数字接口,无需外部SAW滤波器,降低了成本与面积,解决了多模多频段通信的集成难题。
Mohamed El Said, John Vasa, Bala Ramachandran, Masoud Kahrizi, Elias Dagher, Wei-Hong Chen, Martin Vadkerti, Georgi Taskov, Utku Seckin, Hamid Firouzkouhi, Behzad Saeidi, Hasan Akyol, Yunyoung Choi, Amir Mahjoob, Sandeep D’Souza, Chieh-Yu Hsieh, David Guss, Dan Shum, Dean Badillo, Imtiyaz Ron, Doris Ching, Feng Shi, Yong He, Jaleh Komaili, Aravind Loke, Raja Pullela, Engin Pehlivanoglu, Hossein Zarei, Shahrzad Tadjpour, Darioush Agahi, Dmitriy Rozenblit, William Domino, Gregory Williams, Nader Damavandi, Stephane Wloczysiak, Suhanthan Rajendra, Aaron Paff, Tom Valencia Skyworks Solutions, Irvine, CA There has been an increased demand for 3G cell phones that support multiple bands of operation and are backward compatible with the 2G/2.5G standard to provide coverage where 3G networks have not yet been fully deployed. The transceiver design for such a handset becomes complicated with the need for
Tirdad Sowlati, Bipul Agarwal, Joshua Cho, Thomas Obkircher,