⚡ 本页包含 AI 生成的分析内容,仅供参考
本文提出了一款采用75nm工艺的1Gb GDDR5图形内存器件,实现了7Gb/s/pin的数据传输速率。通过引入多种带宽改进技术,解决了高带宽和高密度内存需求之间的矛盾。
S. Kieser, D. Kehrer, M. Kuzmenka, U. Moeller, P. Petkov, M. Plan, M. Richter, I. Russell, K. Schiller, R. Schneider, K. Swaminathan, B. Weber, J. Weber, I. Bormann, F. Funfrock, M. Gjukic, W. Spirkl, H. Steffens, J. Weller, T. Hein Qimonda, Neubiberg, Germany Memory interfaces for high-speed graphics systems have reached the 4 to 6 Gb/s/pin regime with GDDR4 and the introduction of GDDR5 [1-4] at chip densities up to 512Mb. To satisfy the demand for even higher data bandwidths and increased memory densities, more advanced design techniques are required. In this paper, a 7Gb/s/pin 1Gb GDDR5 DRAM with an array architecture for fast column access, a boosting transmitter, multiple voltage (VINT) domains to control on chip power noise, and a high-speed internal VINT power generator system are presented. This 1Gb GDDR5 memory device is fabricated in a conventional 75nm DRAM process and characterized for a 7Gb/s/pin data transfer rate at 1.5V.
R. Kho, D. Boursin, M. Brox, P. Gregorius, H. Hoenigschmid, B. Kho,