← 返回论文列表 📄 下载原文 PDF  ISSCC 2009 · 7.4
ISSCC 2009Session 7 · DRAMMemory75nm CMOS

75nm 7Gb/s/pin 1Gb GDDR5 Graphics Memory Device with Bandwidth-Improvement Techniques

⚡ 本页包含 AI 生成的分析内容,仅供参考

📋 论文概要

本文提出了一款采用75nm工艺的1Gb GDDR5图形内存器件,实现了7Gb/s/pin的数据传输速率。通过引入多种带宽改进技术,解决了高带宽和高密度内存需求之间的矛盾。

💡 主要创新点

核心指标
7Gb/s/pin, 1Gb容量
工艺节点
75nm CMOS
重要性
发表年份
ISSCC 2009

🏷 关键词

GDDR5图形内存高带宽75nm工艺信号完整性

📄 原文摘要

S. Kieser, D. Kehrer, M. Kuzmenka, U. Moeller, P. Petkov, M. Plan, M. Richter, I. Russell, K. Schiller, R. Schneider, K. Swaminathan, B. Weber, J. Weber, I. Bormann, F. Funfrock, M. Gjukic, W. Spirkl, H. Steffens, J. Weller, T. Hein Qimonda, Neubiberg, Germany Memory interfaces for high-speed graphics systems have reached the 4 to 6 Gb/s/pin regime with GDDR4 and the introduction of GDDR5 [1-4] at chip densities up to 512Mb. To satisfy the demand for even higher data bandwidths and increased memory densities, more advanced design techniques are required. In this paper, a 7Gb/s/pin 1Gb GDDR5 DRAM with an array architecture for fast column access, a boosting transmitter, multiple voltage (VINT) domains to control on chip power noise, and a high-speed internal VINT power generator system are presented. This 1Gb GDDR5 memory device is fabricated in a conventional 75nm DRAM process and characterized for a 7Gb/s/pin data transfer rate at 1.5V.

👥 作者与机构

R. Kho, D. Boursin, M. Brox, P. Gregorius, H. Hoenigschmid, B. Kho,

分类:Memory · 年份:ISSCC 2009