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ISSCC 2011Session 7 · MULTIMEDIA & MOBILEDigital Processors

A 275mW Heterogeneous Multimedia Processor for IC-Stacking on Si-Interposer

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📋 论文概要

本文提出一款功耗275mW的异构多媒体处理器,通过硅中介层(Si-interposer)堆叠集成,解决了增强现实等移动应用中对高外部存储带宽的需求。该处理器支持3D图形、视觉处理和浮点运算,并包含纹理缓存,克服了传统方案带宽不足、缺乏缓存等瓶颈。

💡 主要创新点

重要性
发表年份
ISSCC 2011

🏷 关键词

异构多媒体处理器硅中介层高内存带宽

📄 原文摘要

processing, vision, and 3D graphics require high external memory bandwidth. In augmented-reality (AR) processors [1], both 3D graphics and vision operations are required, so memory bandwidth becomes even more critical. In [1], however, memory bandwidth is not considered, floating-point processing is not supported, and there is no cache memory for texturing, which is a performance bottleneck of common graphics pipelines. In this work, a heterogeneous multimedia processor is presented to process various mobile multimedia applications in a single chip on Si-interposer for high memory bandwidth. The implemented processor has 4 key features: (1) A transceiver pool (TRx) that reconfigures strength of output drivers according to the channel loss for IC-stacking on Siinterposer, (2) A mode-configurable vector processing unit (MCVPU) for framelevel parallelism, (3) An energy

👥 作者与机构

Hyo-Eun Kim, Jae-Sung Yoon, Kyu-Dong Hwang, Young-Jun Kim,

Jun-Seok Park, Lee-Sup Kim KAIST, Daejeon, Korea Most data-intensive operations for multimedia applications such as image

分类:Digital Processors · 年份:ISSCC 2011