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ISSCC 2011Session 8 · ARCHITECTURES & CIRCUITS FOR NEXT GENERATION WIRELINE TRANSCEIVERSWireline I/O

A 12.5+12.5Gb/s Full-Duplex Plastic Waveguide Interconnect

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📋 论文概要

该论文提出了一种基于塑料波导的全双工互连方案,实现了12.5+12.5Gb/s的双向数据传输,旨在解决高速、低成本、低开销I/O的需求。

💡 主要创新点

核心指标
12.5+12.5Gb/s
重要性
发表年份
ISSCC 2011

🏷 关键词

塑料波导全双工互连高速I/O

📄 原文摘要

demand for high-speed, low-cost, and low-overhead I/Os in today’s electronic systems, has been addressed by three general categories of interconnects: electrical, optical, and wireless. The electrical interconnects are the oldest and have improved the most, where bit rates in excess of 20Gb/s are achieved over a pair of conductors [1]. At such high bit rates, these serial links must handle transmission line loss, dispersion, impedance mismatches, and electromagnetic crosstalk among multiple lines requiring sophisticated designs, often needing equalization, with their own cost and overhead limitations [2]. Optical fibers as interconnects do not suffer from similar bandwidth limitations or cross-talk issues. However, they require additional electrical-to-optical (EO) and optical-toelectrical (OE) conversion

👥 作者与机构

Satoshi Fukuda1, Yasufumi Hino1, Sho Ohashi1, Takahiro Takeda1,

Satoru Shinke1, Masahiro Uno1, Kenji Komori1, Yoshiyuki Akiyama1, Kenichi Kawasaki1, Ali Hajimiri2 1 Sony, Tokyo, Japan California Institute of Technology, Pasadena, CA 2 The growing

分类:Wireline I/O · 年份:ISSCC 2011